Embodiments pertain to a system for controlling outputting of light towards objects, the system comprising a detection subsystem configured to detect, for at least one object, one or more values of object characteristics, the object characteristics comprising, at least, electromagnetic absorption characteristics, wherein detection of object characteristic values is performed such that the object remains structurally intact; a light source subsystem comprising at least one light source for generating output light and directing the output light towards an object; and a controller configured to control, based on the detected object characteristics values, at least one operational parameter value of the at least one light source such that at least some of the output light that is directed towards the object has electromagnetic characteristics that correspond to the detected values of the electromagnetic absorption characteristics of the object, in order to structurally change at least part of the respective object.

In a battery case sealing method, a lid is fitted to an opening of a battery case, and then a side wall on an inner side of the battery case and a side surface of the lid are brought into contact with each other. The side wall forms the opening. In a state where the side wall on the inner side of the battery case is in contact with the side surface of the lid, a boundary portion between the side wall and the side surface of the lid is welded by irradiating a laser beam in a direction from an outer side of the battery case toward the inner side of the battery case in a thickness direction of the lid.

A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.

Systems, devices, apparatuses and methods for formation of multiple separate light spots with adjustable intensity due to lossless redistribution of the light energy between the separate spots, and with a variable geometry of the multi-spot pattern; advantageously, for laser processing of materials by focusing the laser radiation on a workpiece. The multi-spot pattern is created due to angular polarization splitting of the light beam into several beamlets using a beam splitter and further focusing these beamlets onto a workpiece by a focusing optical system, advantageously by the scanning focusing optics. The beam splitter can include optical birefringent prisms, prism groups and waveplates capable to operate simultaneously at two different wavelengths. Some of these optical elements are rotatable, and their rotations are used for lossless redistribution of light energy between the spots and for a change in the geometric shape of the multi-spot patterns. Embodiments can provide various geometrical configurations of 2, 3, 4, 9 and more separate focused spots: linear, rhombus-shaped, square, parallelogram, rectangular patterns composed in the form of a line or a matrix, with the ability to vary portions of the light energy at the specified separate spots.

Optical device (1) comprising a carrier (4), an optical element (2) and a radiation sink (3), wherein the optical element (2) is mounted on the carrier (4), the optical element (2) is movably attached to the carrier (4), the carrier (4) has a recess (7), wherein the optical device (1) is arranged to interact with electromagnetic radiation (9), dividing the electromagnetic radiation (9) in a first portion (91) and a second portion (92), the optical element is arranged to deflect the first portion in a definable direction, and the second portion (92) is incident into the recess (7) and impinges onto the radiation sink (3).

Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.

Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.

A cylindrical battery includes a bottom-closed cylindrical exterior package can which receives an electrode body. A lead connected to one of a positive electrode and a negative electrode of the electrode body is extended from the electrode body and is welded to a bottom portion of the exterior package can. When the bottom portion is viewed from the outside of the exterior package can, at least a part of the welding portion between the lead and the bottom portion formed by a molten mark is formed outside of a concentric circle of the bottom portion which has a diameter equivalent to the width of the lead.

In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.

A method for bonding semiconductor substrates includes placing a die on a substrate and performing a heating process on the die and the substrate to bond the respective first connectors with the respective second connectors. Respective first connectors of a plurality of first connectors on the die contact respective second connectors of a plurality of second connectors on the substrate. The heating process includes placing a mask between a laser generator and the substrate and performing a laser shot. The mask includes a masking layer and a transparent layer. Portions of the masking layer are opaque. The laser passes through a first gap in the masking layer and through the transparent layer to heat a first portion of a top side of the die opposite the substrate.