A laser processing apparatus includes a light source, a laser head configured to emit a laser beam, a robot configured to move the laser head, and a control apparatus configured to control start and stop of generation of the laser beam and control operation of the robot. The control apparatus controls the light source to generate the laser beam when a first time has elapsed after causing the robot to start an operation of accelerating the laser head such that a movement speed of the laser head with respect to a processing target object reaches a constant target speed.

A laser processing apparatus includes a light source, a laser head configured to emit a laser beam, a robot configured to move the laser head, and a control apparatus configured to control start and stop of generation of the laser beam and control operation of the robot. The control apparatus controls the light source to generate the laser beam when a first time has elapsed after causing the robot to start an operation of accelerating the laser head such that a movement speed of the laser head with respect to a processing target object reaches a constant target speed.

A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning.

A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning.

In various embodiments, a workpiece is processed utilizing primary and secondary laser beams having different wavelengths and which are coupled into specialized optical fibers. The primary and secondary beams may be utilized during different stages of workpiece processing.

A method for joining a metal material element to a plastic material element, in particular a composite material including a plastic matrix reinforced with fibers for use in the construction of motor-vehicle components. The method involves providing one or more slots in a portion of the plastic material element. For each slot, a corresponding tab is provided in the metal material element, having a shorter width and length than a width and length of the slot. The metal material and plastic material elements are arranged in a position of mutual coupling where each tab is inserted through the corresponding slot and has an end portion protruding beyond said portion of the plastic material element. A laser beam is directed above the protruding end portion, so as to locally melt the metal material of each tab and create an enlarged head on each tab that is welded above the plastic material element.

A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.

A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.

A steel sheet that is welded and then cold rolled to a thickness between 0.5 mm and 3 mm, the deformation ratio created by cold rolling in the base metal is equal to ε.sub.MB, for which the deformation ratio created by the cold rolling in the welded joint is equal to ε.sub.S, where:

[00001]$0.4\le \frac{\mathrm{.Math.S}}{\mathrm{.Math.}MB}<0.7.$

A method for quality inspection of laser material processing includes performing laser material processing on a workpiece and generating, by a sensor, raw image data of secondary emissions during the laser material processing of the workpiece. The method also includes determining a quality of the laser material processing by analyzing the raw image data of the secondary emissions.