The damper mechanism used for a high-pressure fuel supply pump is configured so that an outer circumferential surface of a cover in regard to the thickness direction of the base material of the cover engages with the inner circumference of an open end part of a bottomed tubular concave part formed in a damper housing or in a pump housing of the high-pressure fuel supply pump. The total height of the damper as a low-pressure pulsation reducing mechanism can be reduced, and the dimensions of the damper in the radial directions can also be reduced. In cases where the damper mechanism is formed integrally with the high-pressure fuel supply pump, the total height of the high-pressure fuel supply pump can be reduced and the dimensions of the damper part in the radial directions can also be reduced.

The damper mechanism used for a high-pressure fuel supply pump is configured so that an outer circumferential surface of a cover in regard to the thickness direction of the base material of the cover engages with the inner circumference of an open end part of a bottomed tubular concave part formed in a damper housing or in a pump housing of the high-pressure fuel supply pump. The total height of the damper as a low-pressure pulsation reducing mechanism can be reduced, and the dimensions of the damper in the radial directions can also be reduced. In cases where the damper mechanism is formed integrally with the high-pressure fuel supply pump, the total height of the high-pressure fuel supply pump can be reduced and the dimensions of the damper part in the radial directions can also be reduced.

A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.

A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A process for the production of three-dimensional structures involves generating stepped structures in the micrometer to millimeter range. A novel possibility for realizing microstructures for micromechanical and high-performance electronic structures allows a substantially free shaping of and high-throughput production of stepped structures is met according to the invention by coating a copper-clad substrate at least once with a first photoresist for generating a defined height of at least one structure step and coating the first photoresist at least once with a second photoresist for generating a defined height of at least one further structure step, wherein the first photoresist and the second photoresist have different photosensitivities and transmission characteristics which generate structure-forming regions at least of the first photoresist and second photoresist by exposing with different wavelengths and radiation doses and after developing. The structure-forming regions at least partially overlap one another and form a stepped three-dimensional structure.

A method and apparatus comprising a manufacturing process, equipment and a product. The manufacturing process and equipment configured to produce very high precision parts using a laser beam. Embodiments of the manufacturing process and equipment provide an improved method for the production of supercapacitors with critical dimensions on the order of one to fifty microns that can store electricity at very high energy densities using a modified laser beam. Using the manufacturing process and equipment, the proposed improvements allow the production of key parts thousands of times faster than what can be achieved using the usual process, resulting in a manufacturing time suitable for mass production.

Fluorescent rare earth glass frits are suitable for laser marking. A marking composition including fluorescent glass frits is disclosed that is capable of emitting fluorescence under irradiation of ultraviolet rays. A method of forming marks or indicia on a substrate using the fluorescent rare earth glass frits is also disclosed.

In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.

A manufacturing method for manufacturing a fuel cell includes a laser application step and a bonding step. In the laser application step, a laser beam is applied to a carbon film of a separator including a metal plate and the carbon film covering a surface of the metal plate such that the metal plate is exposed by removing the carbon film within an application range of the laser beam. In the bonding step, the separator is bonded to a resin member within a range including at least part of a range where the metal plate is exposed.