Patent classifications
B23K26/346
METHOD OF DETECTING CENTER COORDINATES OF SPOT WELDING MARK, LASER WELDING METHOD, AND BONDING METHOD
A method of detecting center coordinates of a spot welding mark includes: a linear laser light emitting step of emitting a plurality of linear laser light components with a linear irradiation trace on a spot welding mark by emitting laser light through continuous output oscillation; a waveform acquiring step of acquiring a waveform of an intensity of return light which is light generated from a processing point; an outer edge position coordinates deriving step of deriving position coordinates of three or more points on an outer edge of the spot welding mark from a peak position of the intensity of the waveform of the return light; and a center coordinates calculating step of calculating center coordinates of the spot welding mark from the position coordinates of the three or more points on the outer edge derived in the outer edge position coordinates deriving step.
Methods and systems for additive manufacturing
An additive manufacturing system includes an electrode head comprising an array of electrodes for depositing material to form a three-dimensional attachment structure connecting first and second prefabricated metallic parts. The array includes a first plurality of electrodes formed from a first metallic material having a first ductility and a first hardness, and a second plurality of electrodes formed from a second metallic material having a second ductility and a second hardness, wherein the first ductility is greater than the second ductility and the second hardness is greater than the first hardness. A power source provides power for heating each electrode. A drive roll system drives each electrode. A controller is connected to the power source to control operations of the additive manufacturing system to form an interior portion of the attachment structure using the first plurality of electrodes, and control the operations of the additive manufacturing system to form an exterior portion of the attachment structure using the second plurality of electrodes, such that ductility of the interior portion of the attachment structure is greater than ductility of the exterior portion of the attachment structure.
Methods and systems for additive manufacturing
An additive manufacturing system includes an electrode head comprising an array of electrodes for depositing material to form a three-dimensional attachment structure connecting first and second prefabricated metallic parts. The array includes a first plurality of electrodes formed from a first metallic material having a first ductility and a first hardness, and a second plurality of electrodes formed from a second metallic material having a second ductility and a second hardness, wherein the first ductility is greater than the second ductility and the second hardness is greater than the first hardness. A power source provides power for heating each electrode. A drive roll system drives each electrode. A controller is connected to the power source to control operations of the additive manufacturing system to form an interior portion of the attachment structure using the first plurality of electrodes, and control the operations of the additive manufacturing system to form an exterior portion of the attachment structure using the second plurality of electrodes, such that ductility of the interior portion of the attachment structure is greater than ductility of the exterior portion of the attachment structure.
APPARATUSES, SYSTEMS AND METHODS FOR THREE-DIMENSIONAL PRINTING
The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.
APPARATUSES, SYSTEMS AND METHODS FOR THREE-DIMENSIONAL PRINTING
The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.
Induction heating coil and method for manufacturing induction heating coil
An induction heating coil includes a coil section configured to heat a treatment target by induction, a power supply section configured to supply power to the coil section, and a cooling medium passage that is arranged in the power supply section and the coil section, and is configured to supply a cooling medium to the coil section. The coil section, the power supply section, and the cooling medium passage are formed using a metal additive fabrication method.
Induction heating coil and method for manufacturing induction heating coil
An induction heating coil includes a coil section configured to heat a treatment target by induction, a power supply section configured to supply power to the coil section, and a cooling medium passage that is arranged in the power supply section and the coil section, and is configured to supply a cooling medium to the coil section. The coil section, the power supply section, and the cooling medium passage are formed using a metal additive fabrication method.
WELDING DEVICE AND METHOD FOR WELDING AT LEAST TWO COMPONENTS
A welding device and a method for welding at least two components. The welding device includes an ultrasonic welding device and a laser welding device and is configured to weld the two components together by ultrasonic welding in a first area with the aid of the ultrasonic welding device and, during the ultrasonic welding process, to weld the two components together by laser welding in a second area which is smaller than the first area and is arranged within and/or bordering an outer periphery of the first area, with the aid of the laser welding device. The ultrasonic welding device may have an ultrasonic sonotrode and/or an anvil which have a through opening within the first area, and the laser welding device may be configured to direct the laser beam through the through opening onto the second area on the two components.
WELDING DEVICE AND METHOD FOR WELDING AT LEAST TWO COMPONENTS
A welding device and a method for welding at least two components. The welding device includes an ultrasonic welding device and a laser welding device and is configured to weld the two components together by ultrasonic welding in a first area with the aid of the ultrasonic welding device and, during the ultrasonic welding process, to weld the two components together by laser welding in a second area which is smaller than the first area and is arranged within and/or bordering an outer periphery of the first area, with the aid of the laser welding device. The ultrasonic welding device may have an ultrasonic sonotrode and/or an anvil which have a through opening within the first area, and the laser welding device may be configured to direct the laser beam through the through opening onto the second area on the two components.
Apparatus and Method for Directional Etch with Micron Zone Beam and Angle Control
A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.