B23K26/50

SYSTEMS, DEVICES, AND METHODS FOR TISSUE LAYER REMOVAL

The present disclosure provides systems, devices, and methods for penetrating a biological membrane. The system may comprise a laser unit configured to generate one or more laser beams. The system may comprise a set of targeting optics configured to direct the one or more laser beams to a target region of the biological membrane. The system may comprise a raster scanner operatively coupled to the laser unit and the set of targeting optics. The system may comprise a non-transitory computer readable storage medium comprising a set of instructions. The set of instructions may be configured to control at least one of the laser unit, the set of targeting optics, or the raster scanner to photodisrupt the target region of the biological membrane to a target depth while minimizing damage to one or more blood vessels in proximity to the target region.

LASER LIFT OFF SYSTEMS AND METHODS THAT OVERLAP IRRADIATION ZONES TO PROVIDE MULTIPLE PULSES OF LASER IRRADIATION PER LOCATION AT AN INTERFACE BETWEEN LAYERS TO BE SEPARATED

Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

LASER LIFT OFF SYSTEMS AND METHODS THAT OVERLAP IRRADIATION ZONES TO PROVIDE MULTIPLE PULSES OF LASER IRRADIATION PER LOCATION AT AN INTERFACE BETWEEN LAYERS TO BE SEPARATED

Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

Single-position sequential laser welding system
11130196 · 2021-09-28 · ·

Methods and systems for sequentially laser welding terminal tabs of a battery cell to corresponding terminal tabs of a busbar are described using a single laser position and path. The terminal tabs of a battery cell are aligned in contact with terminal tabs of a busbar. A laser welder, from a first position, generates a laser weld beam at a first diameter welding the first terminal tab of the battery cell to the first terminal tab of the busbar. Next, the laser weld beam is narrowed, reducing the first diameter to a smaller second diameter. Without moving the laser welder from the first position, the narrowed laser weld beam burns a hole through the welded first set of terminal tabs, traverses a gap toward a second set of terminal tabs behind the first set and welds the second set together.

FLOTATION CONVEYANCE APPARATUS AND LASER PROCESSING APPARATUS

A flotation conveyance apparatus according to an embodiment conveys a substrate while floating the substrate by ejecting a gas to a lower surface of the substrate. The flotation conveyance apparatus includes an upper plate disposed on the substrate side including a plurality of ejecting ports for ejecting the gas and a lower plate disposed under the upper plate. Flow-paths for supplying the gas to the plurality of ejecting ports are provided on at least one of the upper plate and the lower plate.

FLOTATION CONVEYANCE APPARATUS AND LASER PROCESSING APPARATUS

A flotation conveyance apparatus according to an embodiment conveys a substrate while floating the substrate by ejecting a gas to a lower surface of the substrate. The flotation conveyance apparatus includes an upper plate disposed on the substrate side including a plurality of ejecting ports for ejecting the gas and a lower plate disposed under the upper plate. Flow-paths for supplying the gas to the plurality of ejecting ports are provided on at least one of the upper plate and the lower plate.

LASER PROCESSING APPARATUS
20210245299 · 2021-08-12 ·

A laser processing apparatus includes a debris discharging unit disposed in a space between a beam condenser and a workpiece on a chuck table, for drawing and discharging plasma or debris produced at a processing spot on the workpiece by a laser beam applied to a face side of the workpiece. The debris discharging unit includes a dust collecting unit and a suction source connected to the dust collecting unit. The dust collecting unit includes a slanted portion, a ceiling, a bottom wall, and a pair of side walls.

Laser cutting and removal of contoured shapes from transparent substrates

A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

METHOD FOR CUTTING CUT PARTS AND CUTTING DEVICE
20210170618 · 2021-06-10 ·

The invention relates to a method (100) for cutting cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18), wherein the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) produce a cutting pattern (7), said method having the following method step: cutting (106) the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18), wherein the cut parts (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) are arranged in a rectangular, repeating portion (9, 9′) of an endless single ply material web (19), wherein the portion (9) at least one cut part (1, 2, 3, 4, 5, 6; 12, 13, 14, 15, 16, 17, 18) or at least one cutting pattern (7) is contained in part (10, 11). The method additionally comprises a computer program product and a device for cutting by means of a cutting tool.

POLARIZING LAYER, DISPLAY DEVICE WITH THE SAME, AND FABRICATING METHOD FOR THE DISPLAY DEVICE

A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.