The present invention relates to a drop dispenser (1), comprising: a container part (1B) with an interior volume adapted to be partially filled with a liquid phase (2) and a gaseous phase (3) filling the remainder of the interior volume at ambient pressure, the container part (1B) having a displaceable section (1C), and a dropper part (1A) in physical connection and in fluid communication with the interior volume of the container part (1B), comprising an outflow channel (5), connecting the interior volume of the container part (1B) to the environment; wherein the outflow channel (5) comprises a first section (5a) having a proximal end (5ap) and a distal end (5ad), each end having the same or different inner diameter selected independently from each other in the range of 0.09 to 0.19 mm; and a second section (5b) having a proximal end (5bp) and a distal end (5bd); the proximal end (5bp) having an inner diameter in the range of 1 to 3 mm; the distal end (5bd) having an inner diameter in the range of 0.1 to 3 mm, with the proviso that the inner diameter at the distal end of the second section (5bd) is larger than the inner diameter at the proximal end of the first section (5ap); and wherein the first section (5a) of the outflow channel (5) is generated by laser drilling.

The present invention relates to a drop dispenser (1), comprising: a container part (1B) with an interior volume adapted to be partially filled with a liquid phase (2) and a gaseous phase (3) filling the remainder of the interior volume at ambient pressure, the container part (1B) having a displaceable section (1C), and a dropper part (1A) in physical connection and in fluid communication with the interior volume of the container part (1B), comprising an outflow channel (5), connecting the interior volume of the container part (1B) to the environment; wherein the outflow channel (5) comprises a first section (5a) having a proximal end (5ap) and a distal end (5ad), each end having the same or different inner diameter selected independently from each other in the range of 0.09 to 0.19 mm; and a second section (5b) having a proximal end (5bp) and a distal end (5bd); the proximal end (5bp) having an inner diameter in the range of 1 to 3 mm; the distal end (5bd) having an inner diameter in the range of 0.1 to 3 mm, with the proviso that the inner diameter at the distal end of the second section (5bd) is larger than the inner diameter at the proximal end of the first section (5ap); and wherein the first section (5a) of the outflow channel (5) is generated by laser drilling.

An exposure system (10), an exposure apparatus and an exposure method are disclosed. The exposure system (10) includes: a laser unit (11), a light spot switching unit (12) and a lens unit (13); the laser unit (11) is configured for producing a laser beam; the light spot switching unit (12) is configured to direct the laser beam to travel along one of different optical paths based on a desired size of a light spot for a workpiece to be exposed so that a laser beam in correspondence with the desired size of the light spot is obtained; and the lens unit (13) is configured for altering a direction in which the laser beam is incident on the workpiece. The light spot switching unit (12) enables the laser beam to be switched between the different optical paths so as to form light spots sized in different ranges, which can satisfy different needs of workpieces with various critical dimensions. As a result, an improvement in processing adaptability to different workpieces and a significant reduction in cost can be achieved.

An exposure system (10), an exposure apparatus and an exposure method are disclosed. The exposure system (10) includes: a laser unit (11), a light spot switching unit (12) and a lens unit (13); the laser unit (11) is configured for producing a laser beam; the light spot switching unit (12) is configured to direct the laser beam to travel along one of different optical paths based on a desired size of a light spot for a workpiece to be exposed so that a laser beam in correspondence with the desired size of the light spot is obtained; and the lens unit (13) is configured for altering a direction in which the laser beam is incident on the workpiece. The light spot switching unit (12) enables the laser beam to be switched between the different optical paths so as to form light spots sized in different ranges, which can satisfy different needs of workpieces with various critical dimensions. As a result, an improvement in processing adaptability to different workpieces and a significant reduction in cost can be achieved.

A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.

A laser processing apparatus includes an unloading/loading mechanism for unloading a wafer from and loading a wafer into a cassette placed on a cassette placing stand, a chuck table for rotatably holding the wafer unloaded from the cassette by the unloading/loading mechanism, an image capturing unit for capturing an image of a wafer, and a control unit. The control unit controls the unloading/loading mechanism to orient a mark indicating the crystal orientation of a processed wafer in a predetermined direction different from a direction in which the mark of an unprocessed wafer in the cassette is oriented, when the unloading/loading mechanism houses the processed wafer into the cassette.

A laser processing apparatus includes an unloading/loading mechanism for unloading a wafer from and loading a wafer into a cassette placed on a cassette placing stand, a chuck table for rotatably holding the wafer unloaded from the cassette by the unloading/loading mechanism, an image capturing unit for capturing an image of a wafer, and a control unit. The control unit controls the unloading/loading mechanism to orient a mark indicating the crystal orientation of a processed wafer in a predetermined direction different from a direction in which the mark of an unprocessed wafer in the cassette is oriented, when the unloading/loading mechanism houses the processed wafer into the cassette.

Methods and devices for laser welding of mutually overlapping workpieces by pulsed laser beams, for example, Ultrashort-pulsed (USP) laser beams, are provided. In one aspect, a method includes directing a pulsed laser beam through one workpiece onto the other workpiece and moving the pulsed laser beam in a feed direction relative to the two workpieces to produce a weld seam between the two workpieces bearing against one another. A deflection back and forth of the pulsed laser beam directed transversely or parallel to the feed direction is superposed on the pulsed laser beam moved in the feed direction.

A calculating section of a control unit calculates a vertical position Defocus for a condensing lens using a height value H1 of a modified layer in a wafer that is set by a setting section according to the equation (1) below.

Defocus=(thickness T1 of waferheight value H1b)/a(1)

The calculating section calculates an appropriate vertical position for the condensing lens according to the equation (1) depending on the height value H1 of the modified layer that is set by the setting section. Therefore, the vertical position of the condensing lens in laser processing operation can be determined more easily, and a time-consuming and tedious experiment for fine adjustment of the vertical position of the condensing lens does not need to be conducted.

A calculating section of a control unit calculates a vertical position Defocus for a condensing lens using a height value H1 of a modified layer in a wafer that is set by a setting section according to the equation (1) below.

Defocus=(thickness T1 of waferheight value H1b)/a(1)

The calculating section calculates an appropriate vertical position for the condensing lens according to the equation (1) depending on the height value H1 of the modified layer that is set by the setting section. Therefore, the vertical position of the condensing lens in laser processing operation can be determined more easily, and a time-consuming and tedious experiment for fine adjustment of the vertical position of the condensing lens does not need to be conducted.