Examples herein relate generally to methods, and associated components, characterized by the laser welding of crosslinked polyethylene plumbing components so as to create a leak-proof connection with both mechanical and thermal fusion bonds.

A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.

A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.

A method for producing a component structure of two components includes subjecting the components to beam energy for melting in a contact region. A variation of beam current is set to melt the components in the contact region over a defined component depth less than the perpendicular distance between sides of the contact region. A defined beam current pulse is periodically imparted to the variation of the beam current, to melt the components at least approximately over the entire perpendicular distance between the sides of the contact region and to produce in the region of the second side weld regions of a weld root of the weld connecting the components projecting from the contact region and form a pattern which representative of a weld quality. Between the weld regions there is no melting of the components in the region between the defined component depth and the second side.

A method for producing a component structure of two components includes subjecting the components to beam energy for melting in a contact region. A variation of beam current is set to melt the components in the contact region over a defined component depth less than the perpendicular distance between sides of the contact region. A defined beam current pulse is periodically imparted to the variation of the beam current, to melt the components at least approximately over the entire perpendicular distance between the sides of the contact region and to produce in the region of the second side weld regions of a weld root of the weld connecting the components projecting from the contact region and form a pattern which representative of a weld quality. Between the weld regions there is no melting of the components in the region between the defined component depth and the second side.

A mask for thin film deposition of a display apparatus having both end portions coupleable to a frame in a state of tension in a lengthwise direction thereof, the mask including: a first portion having a first thickness and a plurality of pattern holes through which a deposition material may pass; a second portion comprising a welding portion having a second thickness configured to be coupled to a frame; and a third portion connecting the first portion and the third portion, wherein the first thickness is less than the second thickness, and the third portion includes an inclined surface connecting the first portion and the second portion.

A mask for thin film deposition of a display apparatus having both end portions coupleable to a frame in a state of tension in a lengthwise direction thereof, the mask including: a first portion having a first thickness and a plurality of pattern holes through which a deposition material may pass; a second portion comprising a welding portion having a second thickness configured to be coupled to a frame; and a third portion connecting the first portion and the third portion, wherein the first thickness is less than the second thickness, and the third portion includes an inclined surface connecting the first portion and the second portion.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.