A laser blast shield for preventing damage to a first wall of a workpiece opposite a second wall being cut by a laser includes a metal substrate having a micro-textured topology and a highly reflective and thermally conductive metal coating deposited over the micro-textured surface to facilitate spreading of residual laser energy penetrating the second surface and absorption of the laser energy throughout the body of the blast shield.

A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system includes: performing relative positioning of a transfer position of a transfer image and the transparent material in an optical axis direction of a pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction; and irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 μm to 150 μm inclusive at the transfer position.

There is provided a diamond wafer dividing method used when the diamond wafer having a front surface along the {100} plane is divided at planned dividing lines along the <110> direction. The dividing method includes a first modified layer forming step of forming a first modified layer at a linear first region along the planned dividing line, inside the diamond wafer, a second modified layer forming step of forming a second modified layer at a linear second region shifted from the first region in the width direction and the thickness direction with respect to the front surface, and a dividing step of dividing the diamond wafer along the planned dividing lines by giving a force to the diamond wafer in which the first modified layer and the second modified layer are formed.

There is provided a diamond wafer dividing method used when the diamond wafer having a front surface along the {100} plane is divided at planned dividing lines along the <110> direction. The dividing method includes a first modified layer forming step of forming a first modified layer at a linear first region along the planned dividing line, inside the diamond wafer, a second modified layer forming step of forming a second modified layer at a linear second region shifted from the first region in the width direction and the thickness direction with respect to the front surface, and a dividing step of dividing the diamond wafer along the planned dividing lines by giving a force to the diamond wafer in which the first modified layer and the second modified layer are formed.

According to an embodiment, a manufacturing method of a disk drive suspension comprises determining a first position on the outrigger at which a bent portion is to be formed by irradiating a first laser beam, calculating predicted values of pitch and roll angles of a tongue in a case where the bent portion is formed at the first position, determining a second position on the outrigger to which a second laser beam is to be irradiated to make the predicted values approximate to predetermined target values, and irradiating the first laser beam to the first position to form the bent portion, and the second laser beam to the second position.

A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.

A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.

Provided are a method for manufacturing a PDLC membrane electrode, a negative pressure platform, and a PDLC membrane. The method for manufacturing a PDLC membrane electrode includes the following steps: placing a PDLC membrane on a negative pressure platform with a side to be processed facing upwards, and making a liquid crystal activation area of the side to be processed of the PDLC membrane coincide with a transparent area of the negative pressure platform, and other area coincides with a main body area of the negative pressure platform; activating a liquid crystal layer of the PDLC membrane; cutting and tearing off, according to a half-cut area, a PET layer and an electric conduction layer located on the liquid crystal layer, and sweeping or tearing off the activated liquid crystal layer together to expose the electric conduction layer below the liquid crystal layer to form a corresponding electrode.

Provided are a method for manufacturing a PDLC membrane electrode, a negative pressure platform, and a PDLC membrane. The method for manufacturing a PDLC membrane electrode includes the following steps: placing a PDLC membrane on a negative pressure platform with a side to be processed facing upwards, and making a liquid crystal activation area of the side to be processed of the PDLC membrane coincide with a transparent area of the negative pressure platform, and other area coincides with a main body area of the negative pressure platform; activating a liquid crystal layer of the PDLC membrane; cutting and tearing off, according to a half-cut area, a PET layer and an electric conduction layer located on the liquid crystal layer, and sweeping or tearing off the activated liquid crystal layer together to expose the electric conduction layer below the liquid crystal layer to form a corresponding electrode.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.