A radiation pumped heater includes a ceramic substrate which is heated by a laser beam to a steady state temperature. An optical fiber is heated by conduction and radiation emitted from the ceramic substrate.

A radiation pumped heater includes a ceramic substrate which is heated by a laser beam to a steady state temperature. An optical fiber is heated by conduction and radiation emitted from the ceramic substrate.

A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.

A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.

A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.

A method for laser material processing includes generating a first pulsed laser beam that forms a first focus zone, and processing the material with the first pulsed laser beam in order to produce first modifications. The first modifications form a shielding surface. The method further includes generating a second pulsed laser beam that forms a second focus zone, which is formed in elongated fashion along a second focus zone axis and is formed by constructive interference of laser radiation that passes at an angle toward the second focus zone axis. The method further includes processing the material with the second pulsed laser beam to produce second modifications in a second section of the material. At least one part of the laser radiation passes at the angle toward the second focus zone axis impinges on the shielding surface.

A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.

A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.

A laser crystallization apparatus according to an embodiment includes: a light source unit which irradiates a laser beam; and a path conversion unit which converts the laser beam incident from the light source unit into a linear beam having a long axis parallel to a first direction and a short axis parallel to a second direction. The linear beam propagates in a third direction perpendicular to the first direction and the second direction, the path conversion unit includes an incident window extending parallel to a first length direction, an emission window extending parallel to a second direction, a first reflection unit disposed at the same side with the incident window, and a second reflection unit disposed at the same side with the emission window, and the second length direction extends parallel to the first direction in a view of the third direction.

A laser crystallization apparatus according to an embodiment includes: a light source unit which irradiates a laser beam; and a path conversion unit which converts the laser beam incident from the light source unit into a linear beam having a long axis parallel to a first direction and a short axis parallel to a second direction. The linear beam propagates in a third direction perpendicular to the first direction and the second direction, the path conversion unit includes an incident window extending parallel to a first length direction, an emission window extending parallel to a second direction, a first reflection unit disposed at the same side with the incident window, and a second reflection unit disposed at the same side with the emission window, and the second length direction extends parallel to the first direction in a view of the third direction.