A composite member is manufactured by a manufacturing method including adding, on a surface of a base member composed of a first material, a second material different from the first material, using additive manufacturing employing directed energy deposition as an additive manufacturing process. The manufacturing method is performed by placing the base member in a machining area of a machine tool configured to perform subtractive machining. Accordingly, a composite member can be obtained that is manufactured through additive manufacturing and that is in a state in which the composite member can be promptly machined.

A method for treating a surface of a contoured titanium substrate used for adhesively bonded engine components. The method including applying energy from a fiber laser system to a contoured surface of a titanium substrate, the laser energy is distributed to the contoured titanium surface by at least one of direct light of sight, reflection, or scattering of one or more laser beam.

The invention provides a surface treatment method for a magnesium alloy hub. The process includes: cleaning a to-be-treated surface of the magnesium alloy hub; blackening the cleaned to-be-treated surface; and laser cladding the blackened to-be-treated surface, wherein a laser cladding mode is a synchronous powder feeding mode, and a coating material is chromium. According to the surface treatment method for the magnesium alloy hub, air holes can be avoided.

The invention provides a surface treatment method for a magnesium alloy hub. The process includes: cleaning a to-be-treated surface of the magnesium alloy hub; blackening the cleaned to-be-treated surface; and laser cladding the blackened to-be-treated surface, wherein a laser cladding mode is a synchronous powder feeding mode, and a coating material is chromium. According to the surface treatment method for the magnesium alloy hub, air holes can be avoided.

An element chip manufacturing method includes a step of preparing a substrate including a semiconductor layer and a wiring layer formed on the semiconductor layer, the substrate having element regions and a dicing region defining the element regions, a laser grooving step of irradiating a laser beam to the wiring layer at the dicing region, to form an aperture exposing the semiconductor layer, and a step of etching the semiconductor layer exposed from the aperture, with plasma, to divide the substrate into a plurality of element chips. The laser grooving step includes a step of irradiating a first laser beam having a first pulse width, to remove the wiring layer in an edge portion of the dicing region, and a step of irradiating a second laser beam having a second pulse width which is longer than the first pulse width, to remove the wiring layer inside from the edge portion.

A laser marking system comprises a laser energy source that generates a laser beam, a laser controller configured to focus the laser beam over a field of view greater than a size of laser-markable items, and a start-up target that includes laser-safe material and is located within the field of view. The laser controller is further configured to point the laser beam at the start-up target during a start-up phase of the laser energy source and focus the laser beam on one of the laser-markable items after the start-up phase.

A laser marking system comprises a laser energy source that generates a laser beam, a laser controller configured to focus the laser beam over a field of view greater than a size of laser-markable items, and a start-up target that includes laser-safe material and is located within the field of view. The laser controller is further configured to point the laser beam at the start-up target during a start-up phase of the laser energy source and focus the laser beam on one of the laser-markable items after the start-up phase.

A method of laser welding a steel substrate and a ductile iron substrate is disclosed along with a laser welded assembly that may be formed by practicing the disclosed method. The disclosed laser welding method involves forming a laser weld joint between the steel and ductile iron substrates. The laser weld joint includes a fusion zone comprised of austenite ferrous alloy that has a composition derived from intermixing molten portions of the steel and ductile iron substrates as part of the laser welding process. The austenite ferrous alloy that constitutes the fusion zone of the laser weld joint has a carbon content of 2 wt % or more and a nickel equivalent of 60% or more and can be achieved without preheating the steel and ductile iron substrates prior to welding or using a filler wire to introduce a foreign metal into the molten substrate material created by the laser beam.

A silicon wafer forming method includes: a block ingot forming step of cutting a silicon ingot to form block ingots; a planarizing step of grinding an end face of the block ingot to planarize the end face; a separation layer forming step of applying a laser beam of such a wavelength as to be transmitted through silicon to the block ingot, with a focal point of the laser beam positioned in the inside of the block ingot at a depth from the end face of the block ingot corresponding to the thickness of the wafer to be formed, to form a separation layer; and a wafer forming step of separating the silicon wafer to be formed from the separation layer.

A welding method according to an embodiment includes a preparation process and a welding process. A first welding material and a second welding material are prepared in the preparation process. The first welding material and the second welding material are welded in the welding process by irradiating a laser beam on at least one of the first welding material or the second welding material. At least one of the first welding material or the second welding material includes a first portion and a second portion. A laser absorptance of the second portion is higher than a laser absorptance of the first portion. The first welding material and the second welding material are welded in the welding process by irradiating the laser beam on the second portion.