Patent classifications
B23K26/70
METHOD FOR DETERMINING A MINIMUM WIDTH AND AN ATTACHMENT POSITION OF A MICROJOINT AND METHOD FOR MACHINING A WORKPIECE
A method for determining a minimum width of a microjoint by which, when machining a workpiece, in particular a sheet-like workpiece, a workpiece part remains connected to a remaining workpiece of the workpiece. In the method, the minimum width of the microjoint is determined in dependence on at least one machining parameter which influences a relative position of the workpiece part in relation to the remaining workpiece during the machining of the workpiece. A further method determines an attachment position of such a microjoint and a still further method machines the workpiece.
BATTERY ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
In a battery assembly including a first battery and a second battery, the first battery includes a negative terminal, and the negative terminal has a first metal section and a second metal section formed of a metal different from the first metal section. The second metal section is joined to the top of the first metal section with the dissimilar metal joining, and the second metal section is formed with a joint surface and a recessed portion. A method of manufacturing the battery assembly includes a process of inserting a welding assist member into the recessed portion, and a process of placing a bus bar on the joint surface of the negative terminal in which the welding assist member is inserted in the recessed portion, and joining the bus bar onto the joint surface of the negative terminal by laser welding.
Pushing out a plate-shaped workpiece part that has been cut free
A machine for separative machining of a plate-shaped workpiece that has: a first movement unit for moving the workpiece in a first direction (X); a second movement unit for moving a machining head for the separative machining in a second direction (Y); and two workpiece bearing faces for bearing the workpiece. A gap that extends along the second direction (Y) is formed between the workpiece bearing faces. The machine has a push-out unit having a push-out element, wherein the push-out element is movable at least in the second direction (Y) within the gap so as to press, at a predefined push-out position (AP), against a workpiece part that was cut free from the workpiece during separative machining. The disclosure further relates to methods for pushing out a workpiece part which, in particular, was cut free on such a machine.
PROCESSING APPARATUS
A processing apparatus includes a delivery unit for delivering a workpiece between a cassette placed on a cassette rest and a chuck table and a measuring unit for measuring a thickness of the workpiece. The delivery unit includes a base having a non-contact-type suction holder for ejecting air to develop a negative pressure to attract and hold the workpiece under suction out of contact therewith, and a moving unit for moving the base. The height of the non-contact-type suction holder is adjusted according to the thickness of the workpiece measured by the measuring unit to place the non-contact-type suction holder in a position that is spaced from a face side of the workpiece by a distance in a predetermined range while the workpiece is being delivered by the delivery unit.
Method for the additive construction of a structure and computer program product
A method for the additive construction of a structure for a component includes the following steps: providing a prefabricated component for the component on a building board, wherein the component has a separating plane, providing a powder bed from a base material for the structure, moving the building board closer to a coating device, aligning a processing surface and the separating plane of the component for preventing adhesion between the component and the coating device, and optically measuring a surface of the powder bed.
Method for the additive construction of a structure and computer program product
A method for the additive construction of a structure for a component includes the following steps: providing a prefabricated component for the component on a building board, wherein the component has a separating plane, providing a powder bed from a base material for the structure, moving the building board closer to a coating device, aligning a processing surface and the separating plane of the component for preventing adhesion between the component and the coating device, and optically measuring a surface of the powder bed.
System and method for holding a workpiece in position for laser machining and/or welding thereof
A system for holding a workpiece in position and exposing it to laser radiation, such that: the workpiece includes a bottom surface and a top surface that are electrically insulated from each other. The system includes an electrostatic charge generating device for generating electrostatic charges on the top surface; an electrically conductive support for forming, on the bottom surface, electrostatic charges of opposite sign to those generated on the top surface; and a laser device for machining or welding. The electrostatic charge generating device is arranged to be activated before or during the laser machining or welding, such that the workpiece is held in position relative to the electrically conductive support during the machining or welding thereof.
PRODUCTION METHOD FOR WELDING A COPPER CONDUCTOR TO A WORKPIECE, WORKPIECE, AND VEHICLE
A production method for welding a copper conductor to an electrical contact element of a workpiece for electrical contacting. The contact element has a first copper alloy, and the method has the following method steps: mechanical contacting between the copper conductor and the contact element at a join of the contact element, the welding of the copper conductor to the contact element being carried out with the aid of a focused laser beam, the laser beam having a wavelength of less than or equal to 0.6 μm, and a welded seam is produced which has a welding depth that is greater than or equal to 100 μm.
THREE-DIMENSIONAL PRINTING
The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.
THREE-DIMENSIONAL PRINTING
The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.