A process system is a process system performing a processing process on an object by irradiating at least a part of the object with processing light from a processing light source, and includes a combining optical system combining optical path of measurement light from a measurement light source and optical path of the processing light from the processing light source; an irradiation optical system irradiating the object with the processing light and the measurement light from the combining optical system; a position change apparatus changing a relative positional relationship between the object and a light concentration position of the processing light from the irradiation optical system; an light reception apparatus receiving, through the irradiation optical system, light generated by the measurement light with which a surface of the object is irradiated; and a control apparatus controlling the position change apparatus by using output from the light reception apparatus.

A process system is a process system performing a processing process on an object by irradiating at least a part of the object with processing light from a processing light source, and includes a combining optical system combining optical path of measurement light from a measurement light source and optical path of the processing light from the processing light source; an irradiation optical system irradiating the object with the processing light and the measurement light from the combining optical system; a position change apparatus changing a relative positional relationship between the object and a light concentration position of the processing light from the irradiation optical system; an light reception apparatus receiving, through the irradiation optical system, light generated by the measurement light with which a surface of the object is irradiated; and a control apparatus controlling the position change apparatus by using output from the light reception apparatus.

A laser processing device and a laser processing method that are capable of forming a high-quality semiconductor film are provided. An ELA device (excimer laser annealing device) (1) includes a laser oscillator (10) that generates laser light for forming a polysilicon film by irradiating an amorphous silicon film over a substrate to be processed with the laser light, a pulse measuring instrument (100) for detecting first partial light and second partial light contained in the laser light, and a monitoring device (60) for comparing a detection result of the first partial light with a detection result of the second partial light.

A machining program generation device that generates a machining program for controlling a 3D printing apparatus to form an object by stacking a plurality of layers, includes: a machining route generation unit that extracts a plurality of support points that are based on an end point, an intersection point, and a bending point of the machining path from machining path data indicating a shape and a position of the machining path for forming each of the plurality of layers, and generates a machining route by adding, to the machining path, an order of shaping indicating that shaping of the support points is to be executed first and then shaping of a gap line segment connecting the plurality of support points shaped is to be executed; and a machining program generation unit that generates a machining program for controlling the 3D printing apparatus according to the machining route.

A method for comparing laser machining systems is provided, wherein a laser machining system comprises a laser machining head and a sensor module having at least one photodiode for detecting process radiation, said method comprising: detecting radiation emitted from a light source by means of the photodiode and generating a corresponding intensity signal, wherein the radiation is guided from the light source to the photodiode by at least one optical element in the laser machining head and/or by at least one optical element of the sensor module; aligning the laser machining head and the light source with one another so that the intensity signal assumes a maximum value; and comparing the intensity signal with at least one predetermined reference value. A method for monitoring a laser machining process and an associated laser machining system are also provided.

An automatic landing method, system, and storage medium for laser processing. The method includes: adjusting the relative position of the microscope objective and the workpiece to be processed along the direction of the optical axis within a preset travel range; during the adjustment process, collecting images of the workpiece to be processed in real-time and detecting the intensity of reflected light or fluorescence in real-time according to the image; determine the position of the strongest reflected light or the fluorescence initiation position according to the intensity detection data of reflected light or fluorescence. By scanning the intensity of reflected light or fluorescence, the invention achieves the purpose of quickly and accurately adjusting the laser focus to land on the surface to be processed, effectively improving the processing success rate, processing quality, and processing accuracy, and the solution is economical and efficient.

A method for cutting machining of a plate-shaped workpiece, including determining the position of the support points either by measuring or inferring the position of the support points and/or the relative position of the workpiece, establishing starting-point-free regions, establishing end-point-free regions, establishing starting-point-free and end-point-free regions depending on the inferred or measured position of the support points and/or the relative position of the workpiece, establishing a grid of possible starting points and end points, omitting the starting-point-free and end-point-free regions determined in advance, either calculating a torque in a stabilizing and/or tilting direction or calculating a tilt height and/or a tilt depth for each of the points on the grid, setting a priority of points on the grid, transmitting the priority of points to a route planning means of the cutting head, and selecting one of the points on the grid and carrying out the cutting machining.

The objective of the present invention is to provide a conveyor for discharging scraps of a laser notching machine. The present invention comprises: a conveyor (20); a suction duct (52) which is connected to the conveyor (20) so as to suck, from the conveyor, scraps (2S) generated when a tab (2C) is formed on a pole plate (2) passing through the conveyor (20); and a scrap discharge hole (34) for sucking and discharging the scraps (2S) from the conveyor (20), wherein the conveyor (20) includes: a conveyor body (22); and a conveyor belt (24) for performing a continuous track motion so as to pass the upper and lower surfaces of the conveyor body (22), wherein the conveyor body (22) has a vacuum sector (22VS) and a vacuum release sector (22RS), the vacuum sector (22VS) is configured to have a vacuum suction hole communicating from the inner space portion of the conveyor body (22) to the bottom surface of the conveyor body (22), and the scrap discharge hole (34) is disposed under the vacuum release sector (22RS).

A laser processing apparatus includes: an electro-optical element; a laser irradiation unit that irradiates the electro-optical element with laser; a pair of electrodes provided on both sides of the electro-optical element so as to sandwich the electro-optical element therebetween; a cushioning material having conductivity provided between the pair of electrodes and the electro-optical element; a shield material that is provided on an incident side of the electro-optical element, in an irradiation direction of the laser intersecting a direction in which a voltage applied by the pair of electrodes is applied, and prevents incidence of the laser onto the cushioning material; and a cooling unit that cools the shield material. The cooling unit includes a cooling block and a pipe connected to the cooling block.

The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.