Systems, devices, and methods for additive manufacturing are provided that allow for components being manufactured to be assessed during the printing process. As a result, changes to a print plan can be considered, made, and implemented during the printing process. More particularly, in exemplary embodiments, a spectrometer is operated while a component is being printed to measure one or more parameters associated with one or more layers of the component being printed. The measured parameter(s) are then relied upon to determine if any changes are needed to the way printing is occurring, and if such changes are desirable, the system is able to implement such changes during the printing process. By way of non-limiting examples, printed material in one or more layers may be reheated to alter the printed component, such as to remove defects identified by the spectrometer data. A variety of systems, devices, and methods for performing real-time sensing and control of an additive manufacturing process are also provided.

Systems, devices, and methods for additive manufacturing are provided that allow for components being manufactured to be assessed during the printing process. As a result, changes to a print plan can be considered, made, and implemented during the printing process. More particularly, in exemplary embodiments, a spectrometer is operated while a component is being printed to measure one or more parameters associated with one or more layers of the component being printed. The measured parameter(s) are then relied upon to determine if any changes are needed to the way printing is occurring, and if such changes are desirable, the system is able to implement such changes during the printing process. By way of non-limiting examples, printed material in one or more layers may be reheated to alter the printed component, such as to remove defects identified by the spectrometer data. A variety of systems, devices, and methods for performing real-time sensing and control of an additive manufacturing process are also provided.

To provide a laser irradiation apparatus which suppresses adhesion of foreign matters to an optical element, a laser irradiation device includes: emission optical systems, which form a beam in which laser light generated by a laser oscillator converges on a predetermined beam spot, and continuously change an irradiation direction or the like of the beam; and a protective member which is arranged between the emission optical system and the beam spot, and protects the emission optical system from foreign matters scattered from an irradiation object side, and the protective member has an aperture through which the beam passes and moves in connection with a change of the irradiation direction or the like of the beam so that the aperture is positioned on a path of the beam.

An apparatus and method of improving the stability and repeatability of the laser cutting of an RFID antenna is disclosed. The present invention provides direct feedback from an optical inspection of the cutting process to the control system to determine the shape of the RFID antennas that are being cut and compare the same to the desired RFID antenna shape or pattern. When appropriate, the present invention enables a user to employ both short term and long term feedback data to make modifications to the laser cutting process to improve the same and reduce waste.

A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.

A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.

There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.

A method of confirming an optical axis of a laser processing apparatus includes placing an image capturing unit so as to be movable in X-axis directions, removing a second mirror and capturing an image of a laser beam with the image capturing unit for receiving the laser beam reflected by a first mirror, installing the second mirror and capturing an image of the laser beam with the image capturing unit for receiving the laser beam reflected by a third mirror, and determining whether an optical axis of the laser beam reflected by the first mirror and an optical axis of the laser beam reflected by the third mirror exist in one XZ plane or not on the basis of the captured images and a reference line in the captured images.

A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

A laser cutting head associable to a machine tool comprises a collimating group to collimate a laser beam coming from a laser emitting apparatus, a focusing group to focus in a focal point the laser beam collimated, an optical element to receive said laser beam focused and reflect a focused first portion thereof, and a wavefront sensor to receive said focused first portion of the laser beam, perform a phase measurement of a wavefront of said focused first portion, obtain a reconstructed wavefront on the basis of the phase measurement and send the reconstructed wavefront to an electronic processor; the electronic processor compares the reconstructed wavefront and a reference wavefront, determines one or more optical aberrations to which the laser beam is subjected, reduces such optical aberrations and changes said focal point.