Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.

A laminate sheet including a weldable margin is formed by laminating metal sheets having a core layer disposed therebetween. The core layer is formed of a core material which includes one or more of a viscoelastic, adhesive and acoustic material. The core layer is selectively distributed such that the laminate sheet includes an adhered region providing a laminate structure, and a non-adhered region including a weldable margin. The non-adhered region is adjacent an edge of the core layer and is characterized by a gap between the first and second metal sheets and by an absence of the core layer in the gap. The non-adhered region defines a weldable margin adjacent a core edge configured such that a weld is formable in the weldable margin without heat affecting the core layer. The laminate sheet can be joined by fasteners installed in the non-adhered region.

An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate 16 having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.

A joined part comprises a first portion and a second portion. The first portion comprises a guide slot at least partially defined by a porous structure. A joint material is disposed within the porous structure. The second portion is disposed within the guide slot and contacts the porous structure and the joint material disposed therein to form an interfacial joint between the first portion and the second portion. A method of manufacturing the joined part includes disposing a joint material into a porous structure of a guide slot of a first portion, inserting a second portion into the guide slot, and contacting the porous structure and the joint material disposed therein to form an interfacial joint between the first portion and the second portion.

The present invention provides a highly reliable solder joint, the solder joint including a solder joint layer having a melted solder material containing Sn as a main component and further containing Ag and/or Sb and/or Cu; and a joined body including a NiPCu plating layer on a surface in contact with the solder joint layer, wherein the NiPCu plating layer contains Ni as a main component and contains 0.5% by mass or greater and 8% by mass or less of Cu and 3% by mass or greater and 10% by mass or less of P, the NiPCu plating layer has a microcrystalline layer at an interface with the solder joint layer, and the microcrystalline layer includes a phase containing microcrystals of a NiCuP ternary alloy, a phase containing microcrystals of (Ni,Cu).sub.3P, and a phase containing microcrystals of Ni.sub.3P.

A lead-free solder preform includes a core layer and adhesion layer coated over surfaces of the core layer, where the preform delivers the combined merits from constituent solder alloys of the core and adhesion layers to provide both high temperature performance and improved wetting in high-temperature solder applications such as die attach. The core layer may be formed of a Bi Alloy having a solidus temperature above 260 C., and the adhesion layer may be formed of Sn, a Sn alloy, a Bi alloy, In, or an In alloy having a solidus temperature below 245 C. The solder preform may be formed using techniques such as: (1) electroplating a core ribbon with an adhesion material, (2) cladding an adhesion material foil onto a core ribbon, and/or (3) dipping a core ribbon in a molten adhesion alloy bath to allow thin layers of adhesion material to adhere to a core ribbon.

A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag.sub.3Sn blades.

The disclosure describes a tempered vacuum glass, which comprises: at least two glass sheets arranged parallel to each other; surrounding edges of adjacent glass sheets being sealed using an edge sealing structure; and support members placed in an array between the adjacent glass sheets to form a vacuum space. The edge sealing structure is a metallic edge-sealing structure. The structure comprises a first transition layer, a first metallized layer, a first intermetallic compound layer, a solder layer, a second intermetallic compound layer, a second metallized layer, and a second transition layer stacked in that order. The first and second metallized layers are in a spongy skeleton structure formed by sintering a metal paste. The first and second transition layers are formed by sintering the metal paste on the adjacent glass sheets, and contain a glass phase layer including metallic particles and a metal oxide layer with a net structure.

The present invention relates to an intermediate product for joining and coating by brazing comprising a base metal and a blend of boron and silicon, said base metal having a solidus temperature above 1040 C., and the intermediate product has at least partly a surface layer of the blend on the base metal, wherein the boron in the blend is selected from a boron source, and the silicon in the blend is selected from a silicon source, and wherein the blend comprises boron and silicon in a ratio of boron to silicon within a range from about 3:100 wt/wt to about 100:3 wt/wt. The present invention relates also to a stacked intermediate product, to an assembled intermediate product, to a method of brazing, to a brazed product, to a use of an intermediate product, to a pre-brazed product, to a blend and to paint.

A thermal interface material and method of making the same includes growing a carbon nanotube array on a first substrate and brazing the distal ends of the carbon nanotube array to a second substrate using a braze material. In at least one embodiment, the braze material includes active elements. The method further includes performing the brazing process in an inert or vacuum atmosphere.