A method for joining components includes providing a first component where the first component is an aluminum die-cast component and has a joining region for disposing and fastening a second component, generating at least in regions an adhesive layer on the joining region by a thermal spraying method, and fastening the second component to the adhesive layer by joining by pressure welding.

The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed. Thereafter arranging a solder preform respectively between the respective joining surface and the nanometer multilayer foil for non-solder coated foils or arranging an additional solder preform for already solder coated nanometer multilayer foils is performed, wherein the solder preform or the additional solder preform includes a larger, in particular double thickness layer compared to another solder preform between the nanometer multilayer foil and the a conductive structure applied to the glass substrate so that a reduction of the temperature introduction into the conductive structure and a leveling of uneven portions is caused. After temporarily applying a pressure force which is applied between the joining surfaces triggering the exothermal reaction of the nanometer multilayer foil is performed by an electrical impulse or a laser impulse.

The present invention relates to composition comprising a blend of at least one boron source and at least one silicon source, and the composition further comprises particles selected from particles having wear resistance properties, particles having surface enhancing properties, particles having catalytic properties or combinations thereof, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 3:100 wt:wt to about 100:3 wt:wt, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of particles in and the particles have an average particle size less than 250 m. The present invention relates further to a method for providing a coated product and a coated product obtained by the method.

A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1000 C. The method includes applying a melting depressant composition on a surface of the first metal part, the melting depressant composition including a melting depressant component that includes phosphorus and silicon for decreasing a melting temperature of the first metal part; bringing the second metal part into contact with the melting depressant composition at a contact point on said surface; heating the first and second metal parts to a temperature above 1000 C.; and allowing a melted metal layer of the first metal component to solidify, such that a joint is obtained at the contact point. The melting depressant composition and related products are also described.

A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.

A method includes disposing a hydride of a transition metal on a first metallic material, where at least one of the first metallic material or a second metallic material includes a surface oxide layer. The method includes performing a diffusion bonding operation to bond the first metallic material to the second metallic material. During the diffusion bonding operation, the hydride of the transition metal chemically reacts with the surface oxide layer.

A method for manufacturing a component having a spatially graded property includes providing a first layer of particulate matter, the first layer having first material characteristics, and providing a second layer of particulate matter, the second layer having second material characteristics different from the first material characteristics. The method further includes providing an interlayer between the first layer and the second layer and heating the first layer, the second layer, and the interlayer to bond the first layer with the second layer.

A method for producing a nano-composite metal member, by which a nano-composite metal member can be readily produced and the production cost can be reduced, and a method for joining phase-separated metal solids using the principle same as that of the former method are provided. A nano-composite metal member is obtained by bringing a solid metal body comprising a first component into contact with a solid metal material comprising a compound, an alloy or a non-equilibrium alloy that simultaneously contains a second component and a third component having a positive heat of mixing and a negative heat of mixing, respectively, relative to the first component, and then performing heat treatment at a predetermined temperature for a predetermined length of time, so as to cause interdiffusion between the first component and the third component.

A method for joining heat transfer plates, comprising: applying a melting depressant composition on individual application areas of a first metal sheet, each application area comprising a mid-section and two end-sections; pressing ridges and grooves in the metal sheet, the ridges extending in a direction that extends between the end-sections of the application areas, such that the application areas are located on top of the ridges; bringing the metal sheet into contact with a second, pressed metal sheet, such that contact points are formed where the mid-sections of the application areas relocated; heating the sheets until melted metal is formed at the application areas where the melting depressant composition is applied; and allowing the melted metal to solidify such that a joint is obtained at the contact points.