Patent classifications
B23K35/02
ALUMINUM ALLOY BRAZING SHEET AND ALUMINUM ALLOY BRAZED BODY
An aluminum alloy brazing sheet having a core material, a brazing filler material provided on one surface of the core material, and an intermediate material provided between the core material and the brazing filler material. The core material contains, in mass%, Mn: 0.20% to 2.00%, Si: 0.20% to 1.50%, Cu: 0.20% to 1.50%, and Mg: 0.10% to 0.90%, with the remainder being Al and unavoidable impurities. The intermediate material contains, in mass%, Zn: 0.50% to 8.00%, and Mg: 0.10% to 0.90%, with the remainder being Al and unavoidable impurities. The brazing filler material contains, in mass%, Si: 5.00% to 15.00%, Mg: 0.10% to 0.90%, Bi: 0.10% to 0.50%, and Cu: 0.05% to 0.50%, with the remainder being Al and unavoidable impurities. The aluminum alloy brazing sheet satisfies the formula 10.0≤[Zn]/[Cu]≤40.0.
PASTE COMPOSITION AND SEMICONDUCTOR DEVICE
This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less.
Techniques and assemblies for joining components using solid retainer materials
The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component. The techniques may also include inserting a solid retainer material into the joint region through an aperture in one of the first component or the second component to form a mechanical interlock between the first component and the second component and sealing the aperture to retain the solid retainer material within the joint region. The solid retainer material includes at least one of a metal, a metal alloy, or a ceramic.
Lead-free soldering foil
A lead-free soldering foil, for connecting metal and/or metal-coated components. allows the setting of a defined connecting-zone geometry and, with pores and/or voids being formed only to a minimal extent, achieves a high-temperature-resistant soldered connection that ensures great reliability even in staged soldering processes and increases the thermal conductivity of the connecting zone. The lead-free soldering foil is constructed so that, in a soft-solder matrix, two or more composite wires are each individually sandwiched by roll cladding between two soft-solder strips, parallel to one another and parallel to the edges of the strips. These composite wires include a core, which contains a higher-melting, stronger metal/metal alloy in comparison with the soft-solder matrix and around which a shell of another metal/metal alloy is arranged, and, after the roll-cladding operation, there is still 5 pm to 15 pm of soft-solder material arranged above and below at least one of the cores.
Layered bonding material, semiconductor package, and power module
In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.
MULTI-LAYERED ALUMINUM BRAZING SHEET MATERIAL
The invention relates to a multi-layered brazing sheet material comprising of an aluminum core alloy layer provided with a first brazing clad layer material on one or both sides of the aluminum core layer and at least one second brazing clad layer material positioned between the aluminum core alloy layer and the first brazing clad layer material.
CONNECTION ELEMENT AND TOOL FOR SECURING A CONNECTION ELEMENT TO A COMPONENT VIA FRICTION WELDING
A connection element for securing to a component, in particular a component made of a fiber composite material, comprising a main part, a functional part and a friction welding inlay, which in turn comprises a thermoplastic material. A tool application point is formed on an upper side of the main part. The friction welding inlay may be interlocking.
LEAD-FREE SOLDERING FOIL
A lead-free soldering foil, for connecting metal and/or metal-coated components. allows the setting of a defined connecting-zone geometry and, with pores and/or voids being formed only to a minimal extent, achieves a high-temperature-resistant soldered connection that ensures great reliability even in staged soldering processes and increases the thermal conductivity of the connecting zone. The lead-free soldering foil is constructed so that, in a soft-solder matrix, two or more composite wires are each individually sandwiched by roll cladding between two soft-solder strips, parallel to one another and parallel to the edges of the strips. These composite wires include a core, which contains a higher-melting, stronger metal/metal alloy in comparison with the soft-solder matrix and around which a shell of another metal/metal alloy is arranged, and, after the roll-cladding operation, there is still 5 pm to 15 pm of soft-solder material arranged above and below at least one of the cores.
High-temperature superconducting striated tape combinations
This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.
Pulsed light system
An apparatus for manufacturing a composite article from a composite material. The apparatus comprising: a pulsed broadband radiation source comprising a flashlamp and a light guide adapted to guide light emitted by the pulsed broadband radiation source to a target area. The light guide comprises at least a portion ahead of the pulsed broadband radiation source, relative to the target area, comprising a light transmitting material.