Patent classifications
B23K35/02
Welding wires formed from improved aluminum-magnesium alloys
Aluminum-magnesium alloys useful as welding wire and mechanical support are disclosed. The aluminum-magnesium alloys exhibit improved cold wire drawing performance. Grain refiners and methods of forming the aluminum-magnesium alloys are further disclosed.
LAMINATE INCLUDING ALUMINUM SHEETS
A laminate structure and method of forming is provided. The laminate structure includes a first metal sheet having a first thickness, a second metal sheet having a second thickness, and an adhesive core having an adhesive thickness. The adhesive core is disposed between and bonded to the first and second metal sheets. The first and second metal sheets are made of an aluminum based material and the adhesive core is made of an adhesive material also described as a viscoelastic adhesive material. The laminate structure is configured such that a ratio of the sum of the first and second thickness to the adhesive thickness is greater than either to one (8:1). The laminate structure including the viscoelastic adhesive core is characterized by a composite loss factor at 1,000 Hertz which is continuously greater than 0.1 within a temperature range of 25 degrees Celsius to 50 degrees Celsius.
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
In a copper alloy bonding wire for semiconductor devices, the bonding longevity of a ball bonded part under high-temperature and high-humidity environments is improved. The copper alloy bonding wire for semiconductor devices includes in total 0.03% by mass or more to 3% by mass or less of at least one or more kinds of elements selected from Ni, Zn, Ga, Ge, Rh, In, Ir, and Pt (first element), with the balance Cu and inevitable impurities. The inclusion of a predetermined amount of the first element suppresses production of an intermetallic compound susceptible to corrosion under high-temperature and high-humidity environments at the wire bonding interface and improves the bonding longevity of a ball bonded part.
COLD-ROLLED STEEL SHEET FOR FLUX-CORED WIRE AND METHOD FOR PRODUCING SAME
The present embodiments relate to a cold-rolled steel sheet for a flux-cored wire and a method for manufacturing the same. According to an exemplary embodiment, a cold-rolled steel sheet for a flux-cored wire, including: by wt %, 0.0005 to 0.01% of carbon (C), 0.05 to 0.25% of manganese (Mn), 0.03% or less (except for 0%) of silicon (Si), 0.0005 to 0.01% of phosphorus (P), 0.001 to 0.008% of sulfur (S), 0.0001 to 0.010% of aluminum (Al), 0.0005 to 0.003% of nitrogen (N), 0.5 to 1.7% of nickel (Ni), 0.0005 to 0.0030% of boron (B), and the balance Fe and inevitable impurities, can be provided.
COLD-ROLLED STEEL SHEET FOR FLUX-CORED WIRE AND METHOD FOR PRODUCING SAME
The present embodiments relate to a cold-rolled steel sheet for a flux-cored wire and a method for manufacturing the same. According to an exemplary embodiment, a cold-rolled steel sheet for a flux-cored wire, including: by wt %, 0.0005 to 0.01% of carbon (C), 0.05 to 0.25% of manganese (Mn), 0.03% or less (except for 0%) of silicon (Si), 0.0005 to 0.01% of phosphorus (P), 0.001 to 0.008% of sulfur (S), 0.0001 to 0.010% of aluminum (Al), 0.0005 to 0.003% of nitrogen (N), 0.5 to 1.7% of nickel (Ni), 0.0005 to 0.0030% of boron (B), and the balance Fe and inevitable impurities, can be provided.
Brazed electrode for plasma cutting torch
A silver-copper cutting electrode assembly, and method of manufacture is provided with optimized attributes to allow for improved durability, integrity and manufacturability. An electrode has a silver tip portion which is brazed to a copper body portion where the silver portion and joint have a particular structural relationship.
Systems and methods for welding zinc-coated workpieces
A welding system includes a welding power source configured to provide pulsed electropositive direct current (DCEP), a gas supply system configured to provide a shielding gas flow that is at least 90% argon (Ar), a welding wire feeder configured to provide tubular welding wire. The DCEP, the tubular welding wire, and the shielding gas flow are combined to form a weld deposit on a zinc-coated workpiece, wherein less than approximately 10 wt % of the tubular welding wire is converted to spatter while forming the weld deposit on the zinc-coated workpiece.
Friction element weld element modification to increase corrosion resistance of thermal mechanical joint
A welded structural assembly and method, in one form, includes an upper substrate, a lower substrate adjacent the upper substrate, a fastener, and a sealing member. The fastener includes a shank portion, a first head portion, and a second head portion. The shank portion extends through the upper substrate and into the lower substrate. The shank is welded to the lower substrate. The first head portion has an outer periphery and an underside. The second head portion is frangibly coupled to the first head portion. The sealing member is disposed under the first head portion between the upper substrate and the first head portion. The sealing member contacts the underside and extends beyond the outer periphery such that the sealing member extends radially outward beyond all points of the first head portion.
Aluminum alloy brazing sheet
An aluminum alloy brazing sheet may include a sacrificial material having a function of a brazing material on at least one surface of a core material, wherein the sacrificial material has a composition containing: in a mass %, 2% to 5% of Si; 3% to 5% of Zn; and an Al balance with inevitable impurities the core material is made of an Al—Mn-based alloy, an in the core material before brazing, Al—Mn based secondary particles having an equivalent circle diameter of 100 to 400 nm are distributed with a number density of 0.3 to 5 particles/μm.sup.2.
Wound body of sheet for sintering bonding with base material
To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.