A composition for producing aluminum casting, wrought, and welding filler metal alloys having a chemistry comprising Si varying from approximately 0.1 and 0.9 wt %, Mn varying from approximately 0.05 to 1.2 wt %, Mg varying from approximately 2.0 to 7.0 wt %, Cr varying from approximately 0.05 to 0.30 wt %, Zr varying from approximately 0.05 to 0.30 wt %, Ti varying from approximately 0.003 to 0.20 wt %, and B varying from approximately 0.0010 to 0.030 wt %, and a remainder of aluminum and various trace elements. The alloy is particularly suited to producing high strength structures such as automobiles, truck trailers, rail cars, and ships. It is the first 6xxx series weld filler metal that can be post-weld thermally treated and can weld 3xxx, 5xxx, 6xxx, and 7xxx series base alloys yielding far superior mechanical properties than those attainable from any other aluminum filler metal.

An aluminum alloy brazing sheet exhibits excellent brazability by effectively weakening an oxide film formed on the surface of a filler metal. The aluminum alloy brazing sheet includes a core material and a filler metal, and is used to braze aluminum in an inert gas atmosphere or in vacuum, the core material including aluminum or an aluminum alloy, the filler metal including 6 to 13 mass % of Si, with the balance being Al and unavoidable impurities, and one side or each side of the core material being clad with the filler metal, wherein the core material is clad with the filler metal in a state in which a sheet material is interposed between the core material and the filler metal, the sheet material including one element, or two or more elements, among 0.05 mass % or more of Li, 0.05 mass % or more of Be, 0.05 mass % or more of Ba, and 0.05 mass % or more of Ca, with the balance being Al and unavoidable impurities.

The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.

A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.

A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.

A welding system includes an engine-driven welder generator that produces welding power. A welding torch receives the welding power and applies it to a stick electrode to initiate and maintain a welding arc. A parameter of the welding power, such as voltage, is monitored, such as to determine whether spikes occur during a short time after arc initiation. Based upon the monitored parameter, the engine speed is controlled. The engine speed may be increased or maintained at an elevated level if the monitored parameter indicates that particular types of electrode are being used, such as XX10 or cellulose electrodes.

A welding system includes an engine-driven welder generator that produces welding power. A welding torch receives the welding power and applies it to a stick electrode to initiate and maintain a welding arc. A parameter of the welding power, such as voltage, is monitored, such as to determine whether spikes occur during a short time after arc initiation. Based upon the monitored parameter, the engine speed is controlled. The engine speed may be increased or maintained at an elevated level if the monitored parameter indicates that particular types of electrode are being used, such as XX10 or cellulose electrodes.

Provided are a Cu ball, a Cu core ball, a solder joint, solder paste and foamed solder, which are superior in the impact resistance to dropping and can inhibit any occurrence of poor joints a junction defect. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Cu ball 20. The Cu ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.95, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV.

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.