A robotic wire termination system for efficiently and accurately connecting a plurality of wires to an electrical connector having a plurality of connector pins with corresponding wire receptacles. The system generally includes a housing, a removable alignment plate, a robotic positioner, a heating device, a touch responsive display, and a control unit. The alignment plate removably holds a selected electrical connector in a specific position and orientation with the connector pins exposed in the housing and the wire receptacles exposed outside. The display provides a visual representation of the connector pins and selections of the connector pins. The control unit receives inputs indicating the pin selections and controls the robotic positioner to sequentially move the heating device along three orthogonal longitudinal axes to a series of heating positions relative to the selected connector pins to provide heat for melting solder to connect wires to the wire receptacles.

In various examples, a computer-implemented method of generating instructions for a welding robot. The computer-implemented method comprises identifying an expected position of a candidate seam on a part to be welded based on a Computer Aided Design (CAD) model of the part, scanning a workspace containing the part to produce a representation of the part, identifying the candidate seam on the part based on the representation of the part and the expected position of the candidate seam, determining an actual position of the candidate seam, and generating welding instructions for the welding robot based at least in part on the actual position of the candidate seam.

In various examples, a computer-implemented method of generating instructions for a welding robot. The computer-implemented method comprises identifying an expected position of a candidate seam on a part to be welded based on a Computer Aided Design (CAD) model of the part, scanning a workspace containing the part to produce a representation of the part, identifying the candidate seam on the part based on the representation of the part and the expected position of the candidate seam, determining an actual position of the candidate seam, and generating welding instructions for the welding robot based at least in part on the actual position of the candidate seam.

A welder guard system is disclosed. According to various embodiments of the concepts and technologies described herein, the welder guard system can include a base and a lid attached to the base. The welder guard system can also include a safety switch system having an actuating device and a sensing device. The actuating device can be attached to the lid of the welder guard system and can provide a wireless signal. The sensing device can cause a welding device to prevent a welding jaw of the welding device from closing in response to activation of a clamping operation of the welding device when the sensing device fails to receive the wireless signal provided by the actuating device.

A robotic shear stud welding system includes a stud feeder, a ferrule feeder, at least one work zone, a robot, and a welding gun. The stud feeder is configured to hold a plurality of studs and feed a single stud therefrom. The ferrule feeder is configured to hold a plurality of ferrules and feed a single ferrule therefrom. The robot has a controllable arm that is configured to accurately move between the stud feeder, the ferrule feeder, and each of the at least one work zones. The welding gun is attached to the distal end of the controllable arm. The welding gun is configured to pick up the single stud from the stud feeder, pick up the single ferrule from the ferrule feeder and position the single ferrule at a bottom of the single stud, and shoot the single stud to a workpiece in one of the at least one work zones.

A robotic shear stud welding system includes a stud feeder, a ferrule feeder, at least one work zone, a robot, and a welding gun. The stud feeder is configured to hold a plurality of studs and feed a single stud therefrom. The ferrule feeder is configured to hold a plurality of ferrules and feed a single ferrule therefrom. The robot has a controllable arm that is configured to accurately move between the stud feeder, the ferrule feeder, and each of the at least one work zones. The welding gun is attached to the distal end of the controllable arm. The welding gun is configured to pick up the single stud from the stud feeder, pick up the single ferrule from the ferrule feeder and position the single ferrule at a bottom of the single stud, and shoot the single stud to a workpiece in one of the at least one work zones.

A processing method of a wafer includes a resist film coating step of coating either one surface of a front surface and a back surface with a resist film containing an ultraviolet absorber, a laser beam irradiation step of irradiating the side of the one surface with a laser beam absorbed by the wafer and removing part of the wafer and the resist film along planned dividing lines, a plasma etching step of supplying a gas in a plasma state to the side of the one surface and removing an exposed region of the wafer exposed along the planned dividing lines through plasma etching, and a check step of irradiating plural positions on the side of the one surface of the wafer with ultraviolet rays and detecting light emission of the resist film to measure the thickness of the resist film and check a coating state of the resist film.

A processing method of a wafer includes a resist film coating step of coating either one surface of a front surface and a back surface with a resist film containing an ultraviolet absorber, a laser beam irradiation step of irradiating the side of the one surface with a laser beam absorbed by the wafer and removing part of the wafer and the resist film along planned dividing lines, a plasma etching step of supplying a gas in a plasma state to the side of the one surface and removing an exposed region of the wafer exposed along the planned dividing lines through plasma etching, and a check step of irradiating plural positions on the side of the one surface of the wafer with ultraviolet rays and detecting light emission of the resist film to measure the thickness of the resist film and check a coating state of the resist film.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Systems and methods for machining openings of a component are provided. In one exemplary aspect, a laser system includes features for machining an opening into a component, such as a cooling hole for a CMC component of a gas turbine engine. The component can be oriented in a first position and lasered while oriented in the first position to form a portion of the opening. The component is then oriented to a second position and lasered while oriented in the second position to form another portion of the opening. The component is alternated between the first and second positions until the predetermined geometry of the opening is formed. The component is oriented in the first and second positions such that the laser beam can machine the component without clipping areas that are not desired to be machined.