The invention relates to a method for producing a bipolar plate (5), comprising the following steps: a. providing two planar components (7), which are present in particular in a stacked manner, b. integrally bonding the two planar components (7), in particular by welding, in a joining plane (34), wherein, prior to integrally bonding, internal stresses (9) are introduced into at least one of the two planar components (7). The invention also relates to a fuel cell (1) comprising a bipolar plate (5) produced according to this method.

A device for generating a laser line on a work plane includes a first laser light source configured to generate a first raw laser beam, a second laser light source configured to generate a second raw laser beam, and an optical arrangement configured to reshape the first raw laser beam to form a first illumination beam with a first caustic and a first beam profile, and reshape the second raw laser beam to form a second illumination beam with a second caustic and a second beam profile. The first illumination beam and the second illumination beam are directed with overlap on the work plane and define a joint illumination direction. The first beam profile and the second beam profile jointly form the laser line on the work plane. The optical arrangement is configured to position the first caustic and the second caustic offset from one another in the illumination direction.

Solder paste consisting of 85 to 92% by weight of a tin-based solder and 8 to 15% by weight of a flux, wherein the flux comprises i) 30 to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins, ii) 5 to 20% by weight, based on its total weight, of at least one low-molecular carboxylic acid; and iii) 0.4 to 10% by weight, based on its total weight, of at least one amine, and wherein the combination of the optionally modified natural resins has an integral molecular weight distribution of 45 to 70% by area in the molecular weight range of 150 to 550 and of 30 to 55% by area in the molecular weight range of >550 to 10,000 in the combined GPC.

A method for treating a solid layer includes: providing a multi-layer assembly having a carrier substrate and a solid layer bonded to the carrier substrate by a bonding layer, the solid layer having an exposed surface including a defined surface structure, the defined surface structure resulting from a removal, which is effected by a crack, from a donor substrate, at least in sections; processing the solid layer, which is arranged on the carrier substrate; and separating the solid layer from the carrier substrate by a destruction of the bonding layer.

This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

The invention relates to a method for the media-tight connection of two plate-shaped components (1, 2), in particular two monopolar plates for the production of a bipolar plate, comprising the steps of: placing the first component (1) on a surface of a clamping device, placing the second component (2) on the first component (1), closing the clamping device, setting a first weld seam (3) on the second component (2), wherein a welding depth (t) is selected that is less than a material thickness (s) of the second component (2), with the result that a bend (5) is formed along the first weld seam (3) owing to the welding distortion, via which bend the second component (2) comes into linear contact with the first component (1), setting a connecting weld seam (4) on the first weld seam (3), with the result that the two components (1, 2) are welded to one another along the bend (5).

A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.

A laser ablation device includes: a laser irradiation part to emit a plurality of solid-state laser beams; an optical system to convert the plurality of solid-state laser beams into output light; and a stage to receive an irradiation target to be irradiated with the output light. A minor axis of the output light has a semi-super Gaussian profile of order 2 to order 2.4.

A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.

A field device for processing and automation technology includes a first and a second component that can each be mechanically connected at a joining surface by means of a joining point. Two metal surface layers are each applied at least to the joining surface of the first component and the joining surface of the second component. The metal of the surface layers is different from the metal of the first and/or the metal of the second component. A joining material is applied between the respective joining surfaces of the two components, wherein the joining material includes particles at least partially consisting of a metal that corresponds with the metal of the surface layers The joining of the two components occurs at a joining temperature below 300° C.