A method of removing a plurality of portions of a black layer of an electrical conduit for a photovoltaic cell is disclosed. The method includes providing a mandrel having the electrical conduit electroformed in the mandrel. The electrical conduit is formed in a preformed pattern on an outer surface of the mandrel. The electrical conduit has the black layer with a black layer thickness on a side opposite of the outer surface of the mandrel. A beam of a laser is controlled toward the black layer of the electrical conduit. The beam is characterized by laser parameters. The beam of the laser removes the plurality of portions of the black layer on the electrical conduit. Each removed portion of the plurality of portions of the black layer has a thickness equal to the black layer thickness, and a portion area of 5 mm.sup.2 to 20 mm.sup.2.

A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) which is less than 50 μm, preferably less than 25 μm and particularly preferably less than 15 μm.

Techniques for laser processing of electrochromic glass or other thin-film devices where one or more layers are sandwiched between two thin-film conductive layers include directing a laser beam onto a first position on a surface of a workpiece. The laser beam includes substantially collimated pulses of electromagnetic radiation having an energy density from about 1 J/cm.sup.2 to about 10 J/cm.sup.2 in a spot having a characteristic dimension of at least about 5 mm at the surface of the workpiece. The laser beam removes the material from the first position, then is moved to a second position on the surface of the workpiece and removes material from the second position. The laser beam is then moved to one or more additional positions on the surface of the workpiece and removes material from the one or more additional positions.

A flexible, multi-layered device for automatically sensing sweat biomarkers, storing and transmitting sensed data via wireless network to a computing device having software applications operable thereon for receiving and analyzing the sensed data. The device is functional in extreme conditions, including extremely hot temperatures, extremely cold temperatures, high salinity, high altitude, extreme pHs, and/or extreme pressures.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

A visible light laser system and operation for welding materials together. A blue laser system that forms essentially perfect welds for copper based materials. A blue laser system and operation for welding conductive elements, and in particular thin conductive elements, together for use in energy storage devices, such as battery packs.

A method of forming a package structure includes an etching step, a laser step, a plating step and a singulation step. In the etching step, a plurality of cutting streets of a leadframe are etched. In the laser step, a plastic package material covering on each of the cutting streets is removed via a laser beam. In the plating step, a plurality of plating surfaces are disposed on a plurality of areas of the leadframe without the plastic package material. In the singulation step, the cutting streets of the leadframe are cut to form the package structure.

In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.

There is disclosed a method for manufacturing a stator for a rotary electric machine including: a process of abutting, on each other, tip end parts (40 of one coil piece (52) and an other one coil piece (52) for forming a stator coil (24) of a rotary electric machine (1); and a welding process of irradiating a welding target location regarding the tip end part having been abutted with a laser beam (110) having a wavelength of 0.6 .Math.m or less, in which an output distribution at a focal point of the laser beam has a flat center part.

A cutting device includes: a conveyance unit that conveys a continuous body of a plurality of electrode plates; a laser scanning unit that scans the continuous body with laser light; and a control unit that controls the laser scanning unit. The control unit controls a laser scanning unit so as to scan the continuous body while performing intermit irradiation with laser light, thereby forming a plurality of unit cutting sections that are continuous and dividing the continuous body into a first portion and a second portion. The unit cutting sections have a main line section extending along the boundary of the first portion and the second portion, and a bent section that bends and extends from an end of the main line section.