A wire bonding includes a capillary that extrudes a wire; a wire clamp assembly disposed on the capillary; a support disposed on the wire clamp assembly; a wire contact member; and a slide rail that provides a slide hole. The wire clamp assembly includes: a first member; a second member spaced apart from the first member; a first contact member coupled to the first member; and a second contact member coupled to the second member and spaced apart from the first contact member. The first member includes a first body that extends in a first direction and a first tilting member that extends at an acute angle relative to the first direction. The second member includes a second body that extends in the first direction and is spaced apart from the first body in a second direction a second tilting member.

A welding apparatus includes a welding rod; a temperature measuring jig to measure a temperature of the welding rod; and a welding rod cooler to cool the welding rod.

An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.

Example illustrations are directed to methods and apparatuses comprising battery cells having weld joints. In an example method, a laser is moved to a shoulder of a battery cell. The method may further include micro welding with the laser a first line segment on the shoulder of the battery cell and moving the laser a distance on the shoulder of the battery cell. The method may also comprise micro welding with the laser a second line segment on the shoulder of the battery cell in response to moving the laser the distance. Example battery cell assemblies, e.g., for a battery pack, may have a battery cell and a weld joint on a shoulder of the battery cell. The weld joint may include a first micro weld line segment and a second micro weld line segment separated by a distance.

The invention relates to laser equipment, specifically pulsed scanning lasers used to cut brittle substrates. The authors propose a method and device for forming a stressed edge in the substrate for cleaving of the substrate, to which end a track of cavities is formed through optically induced breakdown in the body of tire material during its irradiation with a focused laser beam with a fixed focal distance during the course of angled scanning of the laser beam, with longitudinal movement along the length of the substrate. The technical result is: improved strength parameters of products and better quality of straight and oblique edges formed during substrate cleaving, absence of chips and microcracks, high rate of formation of the stressed cleaving edge, which implies faster laser cutting.

A welded body manufacturing method for a welded body in which a terminal formed of a metal base material and plated with a metal material having a hardness lower than a hardness of the metal base material is connected to an end portion of a conductive member, the conductive member being connected to the terminal on a conductor welding surface of the terminal is provided. The manufacturing method includes forming at least one of a convex portion and a concave portion on the conductor welding surface and connecting the conductive member to the conductor welding surface by means of ultrasonic welding.

Provided are a manufacturing apparatus and a manufacturing method of an electrode for a secondary battery which forms a large number of holes in the electrode mixture having a level difference in thickness, by irradiating twice or less with a nanosecond laser, and an electrode for a secondary battery manufactured by the same.

A battery module and a method of manufacturing the same includes: a battery cell stack including a plurality of battery cells, a bus bar frame connected to the battery cell stack, at least one electrode lead connected to the battery cell stack and containing a first metal; and a bus bar overlapping with the at least one electrode lead and containing a second metal, the at least one electrode lead and the bus bar are welded to form a welded portion, the welded portion includes a first region in which a central portion is located in the at least one electrode lead and a second region in which the central portion is located in the bus bar, and precipitates of the first metal and the second metal are distributed in both the first region and the second region.

A connection structure of laminate cells is provided. Each of the laminate cells includes a pouch including a laminate film, an electrode assembly enclosed in the pouch, and a plate-shaped terminal connected internally of the pouch to the electrode assembly and extending out of the pouch along one side edge of the pouch. The plate-shaped terminal includes a bent tip. The pouches are stacked on each other, the bent tips of the plate-shaped terminals are overlapped with each other, and the bent tips are intermittently joined together in an overlapped portion where the bent tips are overlapped with each other.

A device includes a first laser emitter, a second laser emitter, and a separating portion. The first laser emitter is configured to emit, in an outer circumferential portion of a bonded substrate including a first substrate and a second substrate bonded to each other, a first laser beam into the first substrate from a side of the first substrate to form a modified layer. The second laser emitter is configured to emit a second laser beam to a material layer that is arranged between the first substrate and the second substrate and is provided on the second substrate from a side of the second substrate, to cause peeling between the second substrate and the material layer. The separating portion is configured to separate an outer circumferential portion of the first substrate and an outer circumferential portion of the material layer from the outer circumferential portion of the bonded substrate.