A toothed transmission element includes a partial region formed with a first material, teeth defining an edge region which is formed additively with a second material having a hardness which is greater than a hardness of the first material, and a third material located between the first material and the second material, wherein a hardness decreases stepwise along a section leading from the edge region to the partial region.

Provided is a device for assembling a fuel supply pipe of which a joint portion between a pipe body and a short cylindrical member has a high strength and which has high anti-corrosion performance. Specifically, while a laser beam in a defocused state is being emitted to impinge on an end portion of the pipe body that overlaps the short cylindrical member, the pipe body and the short cylindrical member are rotated through one complete turn relative to the laser beam, thereby melting the entire periphery of the end portion. While the laser beam in a defocused state is being emitted to impinge on the melted end portion, the pipe body and the short cylindrical member are rotated through at least one further complete turn, thereby joining by welding the end portion to the outer periphery of the short cylindrical member.

A method for processing a foil comprising lithium includes irradiating the foil with a laser beam having a wavelength of between 200 nm and 1 μm.

Provided are metal particles for an adhesive paste, a solder paste composition including the same, and a method of preparing the metal particles for an adhesive paste. The metal particles for an adhesive paste may include a core including one or more metal materials; and a shell arranged on part or an entirety of the core and including one or more metal materials. The metal material of the core may have a melting point higher than that of the metal material of the shell. An intermetallic compound is capable of being formed between the metal material of the core and the metal material of the shell. A ratio (D90/D10) of the 90% cumulative mass particle size distribution (D90 size) to the 10% cumulative mass particle size distribution (D10 size) in a particle size distribution of the metal particles may be 1.22 or less.

Disclosed is a pyrometallurgical process for producing a crude solder comprising at least 9.5-69% wt of tin and at least 25% wt lead, at least 80% tin and lead together, 0.08-12% wt of copper, 0.15-7% wt of antimony, 0.012-1.5% wt of bismuth, 0.010-1.1% wt of zinc, at most 3% wt of arsenic, at most 2.8% wt of nickel, at most 0.7% wt of zinc, at most 7.5% wt of iron and at most 0.5% wt of aluminium, from a feedstock selected in terms of its levels of Sn, Cu, Sb, Bi, Zn, As, Ni and Pb, the process comprising at least the steps of obtaining in a furnace a liquid bath of metal and slag, introducing a reducing agent and optionally also energy, separating the crude solder from the slag and removing liquid from the furnace. The crude solder may readily be further prepared to become suitable as feedstock for vacuum distillation.

A joint structure according to an embodiment of the present invention is provided with: a first member that is made of a metal material and has a plurality of holes having an opening diameter of 30-100 μm formed in a surface thereof; a third member that is made of a metal material the same as or different from that of the first member, or a thermoplastic resin, and that has a plurality of independent holes having an opening diameter of 30-100 μm formed in a surface thereof; and a second member that is made of a curable resin and joins the surface of the first member in which the holes are formed and the surface of the third member in which the holes are formed.

A low melt superalloy powder mixture is provided for use with additive manufacturing or welding metal components or portions thereof. The low melt superalloy powder may include by weight about 9.5% to about 10.5% chromium, about 2.9% to about 3.4% cobalt, about 8.0% to about 9.0% aluminum, about 3.8% to about 4.3% tungsten, about 0.8% to about 1.2% molybdenum, about 10% to about 20% tantalum, about 3% to about 12% hafnium, and at least 40% nickel.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure.

A method of repairing a superalloy component includes a series of sequential steps. The steps are, cleaning the component, applying brazing material to the component, heat treating the component, inspecting the component, preparing the surface of the component, welding the component, and performing a second inspection of the component. The superalloy component is comprised of a high gamma prime superalloy.

A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.