B23K2103/08

Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a method
20220362891 · 2022-11-17 ·

A method for manufacturing a metal-ceramic substrate (1) includes providing a ceramic layer (10), a metal layer (20) and a solder layer (30) coating the ceramic layer (10) and/or the metal layer (20) and/or the solder layer (30) with an active metal layer (40), arranging the solder layer (30) between the ceramic layer (10) and the metal layer (20) along a stacking direction (S), forming a solder system (35) comprising the solder layer and the active metal layer (40), wherein a solder material of the solder layer (30) is free of a melting point lowering material and bonding the metal layer (20) to the ceramic layer (10) via the solder system (35) by means of an active solder process.

Solder alloy, solder power, and solder joint

A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2).
300≤3As+Sb+Bi+Pb  (1)
0.1≤{(3As+Sb)/(Bi+Pb)}×100≤200  (2) In the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.

Apparatus for manufacturing display device and method of manufacturing display device
11584090 · 2023-02-21 · ·

There is provided a an apparatus for manufacturing a display device. An apparatus for manufacturing a display device comprises a body generating ultrasonic vibration; and a horn including a horn body portion connected to the body and amplifying the ultrasonic vibration and a horn tip portion connected to the horn body portion and applying the ultrasonic vibration onto a bonding object, wherein the horn body portion includes at least one body groove surrounded by the horn body portion and completely penetrating the horn body portion in a thickness direction from the surface of the horn body portion.

High temperature capable braze assembly

The present invention relates to an article comprising a ceramic substrate (310) comprising a source of zirconium oxide; a metallic substrate (320); and a braze joint disposed between the ceramic substrate and the metallic substrate. The braze joint comprises (i) a gold rich phase (330) interfacing against a surface of the ceramic substrate. The gold rich phase comprises a refractory metal selected from the group consisting of molybdenum, tungsten, niobium, tantalum and combinations thereof; and (ii) a second metallic phase (340) comprising a metal selected form the group consisting of nickel, iron, vanadium, cobalt, chromium, osmium, tantalum or combinations thereof.

ELECTRONIC COMPONENT, LEAD PART CONNECTION STRUCTURE, AND LEAD PART CONNECTION METHOD
20230093829 · 2023-03-30 · ·

Provided are an electronic component, a lead part connection structure, and a lead part connection method which can reduce damage of a lead part and improve joint strength. In this lead part connection structure, a lead part (3) made of a conductor and a conductive wire (5) made of a plurality of core wires (52) are connected to each other through welding, wherein the lead part (3) and the conductive wire (5) are connected to each other through welding in a condition in which the lead part (3) is fitted into the plurality of core wires (52) of the conductive wire (5). In the conductive wire (5), the core wires (52) are not integrated with each other in advance through welding.

TECHNIQUES AND ASSEMBLIES FOR JOINING COMPONENTS

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.

Joining device and joining method

A joining device and method for laser-based joining of two components includes a first laser radiation source, a first radiation guide connected to the first radiation source to couple first laser radiation into the first radiation guide, a second laser radiation source, at least one second radiation guide connected to the second radiation source to couple second laser radiation into the second radiation guide, and a focusing device coupled to the laser radiations and focusing them at a distance from each other into a joining zone of the components. To reduce installation effort, the focusing device focuses the first and second laser radiations through a common beam path and a coupling device is connected on its input side to the first and second radiation guides and on its output side to the focusing device. The coupling device couples the first and second laser radiations into the common beam path.

Multidirectional synchronized ultrasonic devices and methods for assisting wire arc additive manufacturing

Devices and methods to assist wire arc additive manufacturing (WAAM) are provided. A non-contact, multidirectional synchronized ultrasonic device can include multiple ultrasonic probes mounted on a nozzle of a WAAM robotic arm. The probes can include one normal probe and a plurality of lateral probes configured to rotate on a parabolic frame. The ultrasonic probe in the normal direction can act by its continual high-frequency oscillation in the arc plasma to enhance the arc push force, while the lateral probes can act on the shape of both sides of the deposit. The combined effect of the probes can generate ultrasonic waves and cavitation in the molten pool.

Aluminum heat exchanger with solderable outer surface layer

An aluminum heat exchanger includes first and second plates with inner and outer surfaces, which are joined by brazing and define at least one fluid flow passage. The first and second plates each comprise a core layer of aluminum or an aluminum alloy having a melting temperature greater than an aluminum brazing temperature. The first plate also includes a first outer clad layer defining the outer surface of the first plate. The first outer clad layer is solderable to a metal layer of an object to be cooled and includes nickel or copper. A second outer clad layer is located between the first outer clad layer and the core layer and is roll bonded to at least the second outer clad layer. A manufacturing method includes brazing first and second plates, where the layers of the first plate are roll bonded and the first plate is optionally formed before brazing.

Method of diffusion bonding utilizing vapor deposition

A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.