Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.

Sealed end points and methods of making the same are disclosed. An example method includes disposing a first flange of a lid within a groove of a housing. The groove is defined by first and second walls of the housing and lid. The method also includes means for welding two stationary components while rotating a third component to weld the three components together. The second flange is positioned between the first flange and the first wall. The housing, the lid, and the collar include a thermoplastic material. The method includes securing the housing and the lid relative to one another and spin welding the housing, the lid, and the collar.

An appropriately configured pulsed laser is focused onto a graphene sheet and is used to form a desired pattern in the graphene. When the laser pulse strikes the graphene, it modifies the bonding state of the carbon atoms in the graphene lattice, acting as a blade and causing a separation in the graphene sheet at the site of the laser pulse without causing damage to the surrounding graphene. The width of the separation, or cut in the graphene sheet can be controlled by controlling characteristics of the laser pulse such as beam shape, beam intensity, pulse width, repetition rate, and wavelength to produce a graphene material having desired electrical, optical, thermal, and/or mechanical properties.

A method of manufacturing a semiconductor device package includes encapsulating at least partially a plurality of semiconductor chips with encapsulating material to form an encapsulation body. The encapsulation body has a first main surface and a second main surface. At least one of a metal layer and an organic layer is formed over the first main surface of the encapsulation body. At least one trace of the at least one of the metal layer and the organic layer is removed by laser ablation. The encapsulation body is then separated into a plurality of semiconductor device packages along the at least one trace.

The present disclosure relates to methods of laser-leaching polycrystalline diamond (PCD), devices for performing such methods, and to laser-leached PCD and elements and drill bits containing laser-leached PCD.

A laser processing apparatus includes a laser generator for generating laser beams, a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams, and a beam number controller for controlling the number of the plurality of sub-laser beams. Accordingly, the diffractive optic element that splits a laser beam generated by the laser beam generator into a plurality of sub-laser beams and the beam number controller that controls the number of sub-laser beams are provided so that the processing speed of a processing target can be improved and, at the same time, the number of laser beams can be promptly controlled, thereby promptly forming various patterns of the processing target.

An expandable intervertebral cage with living hinges manufactured using 3D printing. The intervertebral cage is configured to expand from an unexpanded to an expanded configuration. The intervertebral cage can include a deployment system, such as a variable volume pouch or deployment cable, to apply force to the intervertebral cage to deploy the intervertebral cage.

Methods capable of forming holes in, etching the surface of, or otherwise ablating substrates, and substrates formed thereby. A first method includes directing a first laser beam pulse towards a substrate to form a hole in a surface thereof and to form a plasma plume at least partially within the hole wherein the plasma plume has insufficient thermal energy and expansion velocity to etch sidewall of the hole, and directing a second laser beam pulse into the plasma plume to increase the temperature and expansion velocity of the plasma plume such that the sidewall is etched causing an increase in the cross-sectional dimension of the hole. A second method includes applying a liquid to a surface of a substrate, and directing a laser beam pulse into the liquid to create plasma on the surface of the substrate that etches portions of the surface of the substrate.

A laser ablation system, and method, facilitates the execution of user-defined scans (i.e., in which a laser beam is scanned across a sample along a beam trajectory to ablate or dissociate a portion of the sample) and enables the user define additional scans while a scan is being executed.

A reaction plate includes a welded plastics planar laminate consisting of an aperture plate and a film, the aperture plate having at least one planar surface and a plurality of apertures in the planar surface of the apertured plate and the film being attached to the planar surface of the apertured plate around the or each aperture by welding. The welding is preferably laser or transmission welding. A method of forming such reaction plates using diode laser welding. An apparatus is provided for handling such reaction plates including performing polymerase chain reactions (PCRs) or primer extensions therewith.