B23K2103/30

High-frequency welding for headgear

Welded headgear sections can be produced by using a weld tool having pins protruding from a weld region contact surface to deliver high-frequency electromagnetic energy to a weld region defined by overlapping top and bottom headgear straps. The pins fully penetrate the top strap and at least partially penetrate the bottom strap. The pins concentrate the electromagnetic energy to achieve a weld joint of acceptable weld strength and aesthetic appeal.

HIGH-FREQUENCY WELDING FOR HEADGEAR
20250262825 · 2025-08-21 ·

Welded headgear sections can be produced by using a weld tool having pins protruding from a weld region contact surface to deliver high-frequency electromagnetic energy to a weld region defined by overlapping top and bottom headgear straps. The pins fully penetrate the top strap and at least partially penetrate the bottom strap. The pins concentrate the electromagnetic energy to achieve a weld joint of acceptable weld strength and aesthetic appeal.

Dual beam laser transfer
12421591 · 2025-09-23 · ·

Methods and devices for transferring biological or non-biological material coated on a front surface of a donor substrate to a front surface of a receiver substrate. An example of implementation: the front surface of the donor substrate is facing the front surface of the receiver substrate. The donor surface comprises a transparent portion and an absorbing layer on a front side of the transparent portion. A first laser beam of a laser irradiates a portion of a back side of the transparent portion to increase the pressure and/or temperature of the absorbing layer to eject a portion of the biological or non-biological material from the donor substrate and transfer the portion of the material to the receiver surface. The portion of the material transferred on the second substrate is post-processed by irradiating with a second laser beam of a laser a portion of the front side of the receiver surface.

DUAL BEAM LASER TRANSFER
20250369086 · 2025-12-04 ·

Methods and devices for transferring biological or non-biological material coated on a front surface of a donor substrate to a front surface of a receiver substrate. An example of implementation: the front surface of the donor substrate is facing the front surface of the receiver substrate. The donor surface comprises a transparent portion and an absorbing layer on a front side of the transparent portion. A first laser beam of a laser irradiates a portion of a back side of the transparent portion to increase the pressure and/or temperature of the absorbing layer to eject a portion of the biological or non-biological material from the donor substrate and transfer the portion of the material to the receiver surface. The portion of the material transferred on the second substrate is post-processed by irradiating with a second laser beam of a laser a portion of the front side of the receiver surface.

Method for joining, by direct brazing, a first part and a second part, including steps of preparing the surface of at least one of the parts

A method for joining, by brazing, a first part and a second part, the steps of preparing at least one of the parts including the following: a) providing a part intended to be brazed, the part being made of carbon or based on titanium, nickel or a CoCr alloy, b) performing inert gas plasma treatment on the part whereby the part is cleaned and an active surface is formed on the part, c) depositing a first layer comprising an active element on the active surface of the part, the active element being a carbide-forming element, d) depositing a second layer of gold on the first layer, whereby the first layer is protected from oxidation and good wetting is ensured.

Through Substrate Via Formation on Patterned Substrates

Methods of processing a substrate are provided herein. In some embodiments, a method for processing a substrate includes: forming through via openings in a substrate from a back side of the substrate to a front side of the substrate, the substrate having front side metal interconnects disposed on the front side of the substrate that are exposed by the through via openings; and filling the through via openings to form through vias and forming back side metal interconnects on the back side of the substrate, wherein the back side metal interconnects are electrically coupled to the front side metal interconnects by the through vias.

Manufacturing method of electrode plate, manufacturing method of secondary battery, electrode plate, and secondary battery

According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active substance provided area A1 in which an electrode active substance layer 24 is provided on a surface of the electrode substrate 22 and including a substrate exposed area A2 in which the electrode active substance layer 24 is not provided and the electrode substrate 22 is exposed, an active substance provided area cutting step for cutting the active substance provided area A1 by a pulse laser, and a substrate exposed area cutting step for cutting the substrate exposed area A2 by the pulse laser. Then, the frequency of the pulse laser in the substrate exposed area cutting step is made to be larger than the frequency of the pulse laser in the active substance provided area cutting step, and the lap rate of the pulse laser in the substrate exposed area cutting step is made to be equal to or more than 90%. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.