Patent classifications
B23K2103/30
Electric motor for laser-mechanical drilling
A high power laser drilling system utilizing an electric motor laser bottom hole assembly. A high power laser beam travels within the electric motor for performing a laser operation. A system includes a down hole electrical motor having a hollow rotor for conveying a high power laser beam having a wavelength less than 1060 nm through the electrical motor.
Direct address laser ablation
A system and method for selectively removing tire material from the bead portions of a cured tire to reduce one or more harmonics of at least one uniformity parameter are disclosed. According to aspects of the present disclosure, tire material is selectively removed using a plurality of direct address commands. The direct address commands specify ablation parameters for discrete ablation segments at specific angular locations around the bead of the tire. The direct address commands are generated by analyzing the desired ablation pattern for the bead of the tire. The ablation device can then be controlled to selectively remove tire material in discrete ablation segments at identified addresses pursuant to the direct address commands to achieve the desired ablation pattern on one or more tracks along the bead portion of the tire using a single pass of the ablation device.
Methods for perforating multi-layer graphene through ion bombardment
Multi-layer sheets of graphene-based material having a plurality of pores extending therethrough are described herein. Methods for making the sheets include exposing a graphene-based material comprising multilayer graphene having from 5 to 20 layers of graphene to a particle beam having an ion energy of at least about 1500 eV to create damage tracks in the graphene sheets. The damage tracks in the graphene sheets are then exposed to a chemical etchant, such as an oxidant to define pores through the stacked graphene sheets. Production of the damage tracks and etching of the damage tracks can take place while the graphene is disposed on a substrate.
Method for manufacturing circuit board
Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.
SYSTEM AND METHOD OF LASER MARKING PRODUCE
The present invention provides systems and methods for laser marking of produce with a laser beam with a center wavelength in the mid-infra-red region without the need for additional surface agents or chemicals to enhance the marking. The present invention further provides produce marked by a laser beam with a center wavelength in the mid-infra-red regions that is free of any additional surface agents or chemicals.
DEVICE FOR MOVING A TREATMENT HEAD AND A TRAY
A device (I) for moving a treatment head (JO) and a tray (20) in relation to a plane P., The tray (20) of any shape is inscribed within a rectangle of width A and length 0.8., and includes a first driver (21) suitable for cooperating with a first actuator (22) so as to move the tray (20) in translation within a plane that is parallel to said plane .P. in a movement zone (30) formed from at least two perpendicular edges associated with a reference frame, Q, y, in a direction that is normally parallel to one of said axes or y, the device. (I) The device includes at least: a mobile arm (11) of length R pivotably mounted on one of its ends about an axis £ that is perpendicular to said plane .P., set in motion by a second actuator.
HIGH FREQUENCY WELDING FOR HEADGEAR
Welded headgear sections can be produced by using a weld tool having pins protruding from a weld region contact surface to deliver high-frequency electromagnetic energy to a weld region defined by overlapping top and bottom headgear straps. The pins fully penetrate the top strap and at least partially penetrate the bottom strap. The pins concentrate the electromagnetic energy to achieve a weld joint of acceptable weld strength and aesthetic appeal.
DEVICE FOR INSCRIBING IDENTIFICATION UNITS, COMPRISING A DROP SHAFT WITH AN INCLINED CHUTE
A device for inscribing identification units, each identification unit including an identification plate or connected single-piece identification plates, each identification plate having an inscription surface, and the inscription surface or a plurality of the inscription surfaces of each identification unit spanning an inscription plane, includes a housing; an inscription device that is arranged in the housing, particularly a laser inscription device; a drop shaft which is arranged in the housing, is accessible via an inlet opening in the housing, is designed for conveying individual identification units to the inscription device, and is delimited by at least one chute for the identification units, the chute being at an incline relative to the horizontal and vertical lines; a support surface which is arranged at the lower end of the drop shaft and spans a support plane in order to support an edge of the identification units; a stopping block that protrudes upwards over the support plane or is arranged over the support plane; and a counter holder that can move towards and away from the stopping block in a feed direction, in order to press identification units that are supported on the support surface against the stopping block, in an inscription position.
Method and Apparatus for Manufacturing an Absorbent Article Including an Ultra Short Pulse Laser Source
The present disclosure relates to methods and apparatuses for assembling absorbent articles, and more particularly, methods and apparatuses for imparting a cut line into one or more layers of an advancing substrate. The advancing substrate may be a belt assembly including an outer layer, an inner layer, and one or more elastic strands disposed between the outer layer and the inner layer. The belt assembly may be rotated on a process member about a longitudinal axis of rotation. The process member may advance the belt assembly to one or more ultra short pulse laser sources. The ultra short pulse laser source imparts a cut line into the belt assembly. A trim removal member may be used to separate the cut line forming a trim portion and a cut edge or separation edge.
METHOD AND DEVICE FOR REMOVING A PLASTIC COATING FROM A BLOCK OF FOOD
A method for removing a plastics coating from a block of food, in particular a whole cheese, operates with the following steps: the block of food, in particular the whole cheese with its plastics coating is fed to the method. A laser beam is then directed onto the plastics coating of the block of food. Herein the output of the laser which emits the laser beam is adjusted so that a removal of the plastics coating takes place by separation of a region of the plastics coating and/or by erosion or vaporisation of the plastics coating. A device for removing a plastics coating from a block of food, in particular a whole cheese, comprises a transport apparatus for the block of food and a laser apparatus for applying a laser beam to the block of food.