B23K2103/30

Method for processing an ultra-high density space interconnect lead under light source guidance

A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.

METHODS FOR OPTICAL MICROPATTERNING OF HYDROGELS AND USES THEREOF
20210371782 · 2021-12-02 ·

The present invention provides methods for optically micropatterning hydrogels, which may be used for, e.g., regenerative medicine, synthetic or cultured foods, and in devices suitable for use in high throughput drug screening assays.

Laser etching apparatus and a method of laser etching using the same
11370065 · 2022-06-28 · ·

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

VEGETATION EDGER WITH LASER AND METHOD
20220161368 · 2022-05-26 ·

A cutting apparatus including a plurality of laser beams for cutting vegetation. The apparatus comprises a housing including side walls being extended generally perpendicular to form a downwardly oriented opening. An electrically powered laser cutting device is positioned centrally within the housing. A transport device is connectable to the housing to provide movement of the housing and laser cutting device along a surface covered by vegetation. The laser cutting device generates at least one laser beam that is directed downward underneath the housing.

HIGH POWER LASER TUNNELING MINING AND CONSTRUCTION EQUIPMENT AND METHODS OF USE

There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.

High frequency welding for headgear

Welded headgear sections can be produced by using a weld tool having pins protruding from a weld region contact surface to deliver high-frequency electromagnetic energy to a weld region defined by overlapping top and bottom headgear straps. The pins fully penetrate the top strap and at least partially penetrate the bottom strap. The pins concentrate the electromagnetic energy to achieve a weld joint of acceptable weld strength and aesthetic appeal.

Pulsed laser method for machining a diamond

A method of machining a diamond includes using a pulsed laser. The diamond is placed in a container containing a transparent liquid. The liquid level is at least 100 microns above a surface of the diamond to be machined, and the transparent liquid can further contain a surfactant additive in an amount of at least 2% and 10% by mass. Next, a laser source is activated such that a laser beam with pulse durations of no longer than one microsecond at a repetition frequency of no more than 5 kHz is applied to the surface to be machined, and relative scanning is performed between the diamond and the laser source, cross-wise to the laser beam and axially in depth, with an amplitude and orientations that are determined by the shape to be machined in the diamond.

DIAMOND CUTTING TOOL AND METHOD FOR MANUFACTURING THE SAME
20220274186 · 2022-09-01 ·

There is provided a diamond cutting tool including a cutting edge portion containing single crystal diamond or binderless polycrystalline diamond and graphite, wherein when Raman spectroscopy is performed on a surface of the cutting edge portion, a ratio R1 of Ig1 to a sum of Id1 and the Ig1 is equal to or more than 0.5 and equal to or less than 1, where the Idi represents a peak intensity of first carbon in the surface, the Ig1 represents a peak intensity of second carbon in the surface, the first carbon represents carbon that forms the single crystal diamond or the binderless polycrystalline diamond.

Packaging film having direct food contact identifiers and method of making thereof

Method for producing a packaging film strip for providing a number of individual packaging film parts for packing food or beverages, wherein the packaging film contains for each designated individual packaging film part an area having a printed two-dimensional code as unique packaging or product identifier. The process comprises the steps of providing at least one first substrate film strip (10, 25), applying on one side of said at least one first substrate film strip (10, 25) an artwork printing (20) for each individual packaging film part, depositing a DFC ink area (28) for each individual packaging film part onto the surface of the substrate film strip (10, 12) lying opposite to the artwork printing (20), slitting the packaging film to provide a series of individual packaging film parts running along the longside of the packaging film, ablating the individual DFC ink areas (28) by a computer-controlled laser beam (8) for providing a predetermined and individual code (2, 3, 30) as unique packaging or product identifier, cleaning the surface of the film strip comprising the individual codes (2, 3, 30), and checking the quality of the codes (2, 3, 30).

SYSTEM, METHOD, AND APPARATUS FOR FUME EXTRACTION

A system, method, or apparatus for controlling the ignition of a volatile organic compound cloud. The system can include a laser source configured to emit one or more laser beams, one or more fume cells, and a conveyor carrying one or more confectionery products. The system is configured to etch the one or more confectionery products using the one or more laser beams. The etching creates a volatile organic compound cloud above the one or more confectionery products. The system is also configured to control one or more factors of the system, where the one or more factors include at least one of laser power, laser wavelength, geometry of laser beam, etch geometry, or fume extraction air flow. The system is further configured to ignite the volatile organic compound cloud based on the controlled one or more factors.