A method for manufacturing a vapor chamber structure includes steps as follows. A first metal board and a second metal board are provided. A wick structure is disposed on at least one of the first metal board and the second metal board. A supporting structure is disposed in a receiving chamber cooperatively defined between the first metal board and the second metal board. The first metal board and the second metal board are assembled correspondingly, and are welded together by high-frequency ultrasonic welding in a frequency range of 20 kHz to 80 kHz. Finally, a vacuuming operation is performed and a working fluid is filled in the receiving chamber, and the receiving chamber is then sealed to form a hermetic sealing space within Therefore, the method does not need a sintering furnace process, and the combining process is quick to thereby increase production capacity and reduce costs.

A method for performance determination of a heat pipe with an arbitrary liquid flow area and prescribed geometric dimensions, an external and internal structure, a heat pipe material and a working fluid, heating and cooling surface areas, and condenser cooling conditions is provided to obtain operating and performance parameters, wherein the operating and performance parameters are temperature distribution within the heat pipe, a heat transferred via a phase change and a conduction, an axial variation of a radius of curvature of a liquid-vapor interface along the heat pipe, a vapor temperature and pressure of the working fluid, by simulating a flow and an energy transfer inside.

A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.

The present disclosure provides a heat pipe capable of preventing deformation of even a thin container and having excellent heat transfer characteristics by preventing freezing of a working fluid even if the longitudinal direction of the container is set substantially parallel to the direction of gravity in cold regions. A heat pipe includes a container having a tubular shape with both ends sealed, a wick structure stored in the container, and a working fluid sealed in the container, wherein, in at least one of cross sections perpendicular to the longitudinal direction of the container, the wick structure is in contact with the inner surface of the container at two points but both side surfaces of the wick structure are not in contact with any inner surface of the container, and a sintered metal layer is formed on the container inner surface being not in contact with the wick structure.

A loop heat pipe includes an evaporator; a condenser; a first pipe configured to connect the evaporator and the condenser and in which vapor-phase working fluid flows; and a second pipe configured to connect the condenser and the evaporator and in which liquid-phase working fluid flows, wherein the evaporator, the condenser, the first pipe, and the second pipe is joined to a first tabular and a second tabular, respectively, the first tabular includes a first recessed section in a region to be formed as the evaporator and a region to be formed as a condensation pipe configuring the condenser and the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe.

A manufacturing method of middle member structure includes steps of applying an external force to a plate body to shape the plate body and form multiple recessed/raised structures and perforating the plate body to form multiple perforations misaligned from the recessed/raised structures so as to achieve a plate body with recessed/raised structures. The middle member structure is applicable to a vapor chamber to enhance the vapor-liquid circulation effect and the support for the internal chamber.

The present invention provides a chamber sealing process for a temperature equalizing plate. The chamber sealing process includes steps of providing a bottom cover, a cover plate and a capillary structure with a sunken groove; forming an inner cavity by enclosing the cover plate and the bottom cover; placing the capillary structure between the cover plate and the bottom cover, and then installing the cover plate in the sunken groove; and performing laser welding on a contact area between the cover plate and the bottom cover to seal the inner cavity for obtaining a temperature equalizing plate with a sealed chamber. It can greatly reduce the manufacturing cost and greatly improve the production efficiency.

A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.