Provided is a heat sink that has a clad structure of a CuMo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of CuMo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the CuMo composite layers or comprises three or more CuMo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the CuMo composite layers are outermost layers on both sides, wherein each of the CuMo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.

A heat sink composed of metal, preferably composed of a solid metal block, in particular composed of aluminium, and also to a method and a tool for the production of same. The heat sink has a plurality of fluid lines for conducting cooling fluid which are separated from one another by heat sink ribs arranged between them, which are arranged next to one another and which run in a parallel manner. It is characterized in that the fluid lines are formed by grooves which are milled into the metal.

A method of manufacturing a liquid-cooled jacket, includes: a placing step for placing a sealing body on a jacket body; a first primary joining step for performing frictional stirring by moving a primary joining rotary tool along a first abutment portion where a step side surface of a peripheral wall stepped portion and an outer peripheral side surface of the sealing body abut on each other; and a second primary joining step for performing frictional stirring by moving the primary joining rotary tool along second abutment portions in each of which a step side surface of a columnar support stepped portion and a hole wall of a hole abut on each other.

A method and apparatus for heat sinking a camera module, which may be used in an automotive camera, which includes but is not limited to automotive rear-view cameras, is described herein. Heating conductors and heat conductive pads may be arranged in a parallel orientation within the housing of the camera module to dissipate heat produced by the printed circuit boards (PCBs) and other components within. The heat conducting pads may conduct heat away from the PCB or component being cooled and into the heat sink, which may be a heat conducting material including but not limited to aluminum, aluminum alloys, or copper. The heating pads may also fill the air gaps within the housing of the camera module.

Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.

Methods and systems for providing a cold plate assembly include providing a base and a cover. The cover can be fixedly coupled to the base. Each of the base and the cover can include spaced internal ribs, which can form flow paths when the base and cover are fixedly coupled together. The internal ribs of the base and the cover can have spaced tabs that can be fixedly coupled to the other of the base or the cover. The base and the cover may also include spaced external or outer sacrificial ribs.

An imaging device including a board section on which imaging element is loaded, a first housing section for fixing board section from a surface on which imaging element is loaded; a second housing section for fixing board section from a surface opposite to the surface on which imaging element is loaded; and a lens section attached to the first housing section side; and the first housing section and the second housing section are fixed by attachment members so as to sandwich board section. The first housing section may be configured from board fixing member for fixing board section, and the lens attachment member for attaching lens section that is fixed to board fixing member in a positionally adjustable manner.

A light-emitting diode (LED) lighting apparatus including at least one LED group including a plurality of LEDs, a rectifier configured to rectify an alternating current (AC) voltage and generate a driving voltage for the at least one LED group, and a system-in-package (SIP) configured to drive and control the at least one LED group, in which the SIP is connected to the at least one LED group and the rectifier, and includes a driving module, a functional module, and a first resistor disposed on a single substrate.

A heat sink having a base and a projecting portion that extends from the base is manufactured by cold pressing a metal component. In the first process, a preparatory compact is formed by pressing the metal component with a first die including a first die block and a first punch. The preparatory compact has a depression on a surface of the metal component that faces the first punch and a protrusion on a surface of the metal component that faces the first die block. In the second process, by pressing the preparatory compact with the second die including a second punch and a second die block, the depression is crushed and the protrusion is pushed out toward the back of the hole of the second die block to form the projecting portion.

A heat sink assembly is provided herein. The heat sink assembly includes at least two heat sinks, a mechanical support member, and a flexible heat pipe. Each of the at least two heat sinks are formed to mate with one of at least two processors. The mechanical support member are formed to mechanically engage with the at least two heat sinks. The flexible heat pipe connects to the at least two heat sinks to provide a thermal link therebetween.