An assembling equipment is for attaching a component to a workpiece. The assembling equipment includes a platform, a conveying mechanism, a first attaching mechanism, a film removing mechanism, and a second attaching mechanism. The conveying mechanism transports a positioning assembly carrying a workpiece to a first station. The first attaching mechanism attaches a first component with a protective film to the workpiece at the first station. The conveying mechanism transports the positioning assembly to a second station, and the film removing mechanism at the second station removes the protective film from the workpiece. The conveying mechanism transports the positioning assembly to a third station. The second attaching mechanism at the third station attaches a second component to the first component on the workpiece to be connected together. The assembling equipment reduces manual labor intensity and labor costs and improves efficiency of production and the product quality.

An assembling equipment is for attaching a component to a workpiece. The assembling equipment includes a platform, a conveying mechanism, a first attaching mechanism, a film removing mechanism, and a second attaching mechanism. The conveying mechanism transports a positioning assembly carrying a workpiece to a first station. The first attaching mechanism attaches a first component with a protective film to the workpiece at the first station. The conveying mechanism transports the positioning assembly to a second station, and the film removing mechanism at the second station removes the protective film from the workpiece. The conveying mechanism transports the positioning assembly to a third station. The second attaching mechanism at the third station attaches a second component to the first component on the workpiece to be connected together. The assembling equipment reduces manual labor intensity and labor costs and improves efficiency of production and the product quality.

The invention relates to a handling device and method for monitoring a handling device having a holding device, in particular a vacuum gripping device or a vacuum tensioning device, for fixing a workpiece, and having a sensor device for detecting vibrations and for generating measured values therefrom. The sensor device is situated on the holding device and is configured for detecting vibrations of the workpiece that is fixed to the holding device.

The invention relates to a handling device and method for monitoring a handling device having a holding device, in particular a vacuum gripping device or a vacuum tensioning device, for fixing a workpiece, and having a sensor device for detecting vibrations and for generating measured values therefrom. The sensor device is situated on the holding device and is configured for detecting vibrations of the workpiece that is fixed to the holding device.

An effector includes at least one contact surface configured to bear against a face of a workpiece near a zone of the workpiece that is impacted by a tool supported by the effector. The contact surface includes at least one interface made of a ductile material interposed between the contact surface and the face of the workpiece.

An effector includes at least one contact surface configured to bear against a face of a workpiece near a zone of the workpiece that is impacted by a tool supported by the effector. The contact surface includes at least one interface made of a ductile material interposed between the contact surface and the face of the workpiece.

A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.

A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.

A work piece processing device includes a tool piece, a work piece holder and a servo-elastic actuator system having simultaneous precision force and position control that moves one of the tool piece and the work piece holder to the other of the tool piece and work piece holder.

A work piece processing device includes a tool piece, a work piece holder and a servo-elastic actuator system having simultaneous precision force and position control that moves one of the tool piece and the work piece holder to the other of the tool piece and work piece holder.