The invention provides a machine tool capable of facilitating a process of switching product ejecting apparatuses. The machine tool comprises a spindle which rotates a workpiece around an axis of the spindle, an actuator which reciprocates a rod arranged parallel to the axis of the spindle, and a coupler switched between a coupling position and a standby position. The coupler connects the rod and an ejecting shaft inserted in the spindle when held in the coupling position. The coupler is not connected to at least the ejecting shaft when held in the standby position. The ejecting shaft along with the coupler is moved in the direction of the axis of the spindle according to reciprocation of the rod when the coupler is held in the coupling position.

A workholding apparatus (10) wherein a draw bar (22) effects chucking and de-chucking of a workpiece (W) and wherein un-seating of the workholding apparatus is effected by piston-like mechanisms (30) located in a machine spindle (2).

A machine for separative machining of a plate-shaped workpiece that has: a first movement unit for moving the workpiece in a first direction (X); a second movement unit for moving a machining head for the separative machining in a second direction (Y); and two workpiece bearing faces for bearing the workpiece. A gap that extends along the second direction (Y) is formed between the workpiece bearing faces. The machine has a push-out unit having a push-out element, wherein the push-out element is movable at least in the second direction (Y) within the gap so as to press, at a predefined push-out position (AP), against a workpiece part that was cut free from the workpiece during separative machining. The disclosure further relates to methods for pushing out a workpiece part which, in particular, was cut free on such a machine.

A machine for separative machining of a plate-shaped workpiece by a processing beam. The machine has a first movement unit for moving the workpiece in a first direction, a second movement unit for moving a processing head in a second direction, two workpiece bearing supports for bearing the workpiece, and a parts chute. The two workpeice bearing supports are separated from each other by a gap that extends along the second direction. The parts chute is movable between a first chute position and a second chute position so as to move a cut-free workpiece part that has dropped into the gap, laterally away from the gap. The machine includes a receiving unit movable in the second direction, to receive the cut-free workpiece part at a transfer position and transport the workpiece part to one or more discharging positions of the machine along the second direction.

A laser processing machine for carrying out hole-forming on a plate-shaped workpiece is provided. A first program storage that stores a plurality of hole-forming programs and a second program storage that stores a plurality of cutout piece drop programs are also provided. A program selector that selects, from the second program storage, a cutout piece drop program associated with a hole-forming program selected from the first program storage to form the hole on the workpiece. A working head controller that controls a laser processing head according to the hole-forming program and the cutout piece drop program that are selected is also provided. A motion path of the processing head after forming the hole on the workpiece and a jetting condition of assist gas to an inside of the outline from the processing head on the motion path are programmed in each of the plurality of cutout piece drop programs.

In a laser processing method for carrying out hole-forming on a plate-shaped workpiece, [A] a hole is formed by laser-cutting the workpiece along an outline of the hole to be formed, [B] a laser processing head is moved with respect to the workpiece after forming the hole, and [C] a cutout piece inside the outline of the hole is dropped off by moving the laser processing head while jetting assist gas from the laser processing head to the cutout piece inside the outline. According to the laser processing method, the cutout piece generated when carrying out hole-forming by laser processing can be prevented from getting stuck in a hole.

A processing machine has a holding unit, which includes a holding surface, a suction valve, an air ejection valve, a water ejection valve, a plurality of suction openings, and a suction-openings suction valve that establishes or interrupts communication between the suction openings and a suction source. An unloading method of a wafer in the processing machine includes a separation step of separating the wafer from the holding surface by closing the suction valve and opening the air ejection valve and the water ejection valve such that a mixed fluid of air and water is supplied to the holding surface, and an unloading step of unloading, from the holding surface, the wafer separated from the holding surface. The separation step includes a drawing step of opening the suction-openings suction valve and drawing the mixed fluid outside of the holding surface.

The invention provides a machine tool capable of facilitating a process of switching product ejecting apparatuses. The machine tool comprises a spindle which rotates a workpiece around an axis of the spindle, an actuator which reciprocates a rod arranged parallel to the axis of the spindle, and a coupler switched between a coupling position and a standby position. The coupler connects the rod and an ejecting shaft inserted in the spindle when held in the coupling position. The coupler is not connected to at least the ejecting shaft when held in the standby position. The ejecting shaft along with the coupler is moved in the direction of the axis of the spindle according to reciprocation of the rod when the coupler is held in the coupling position.

A wire electric discharge machine for machining a workpiece includes a handling device for handling core pieces produced by the machine during the machining of the workpiece and upper and lower wire guiding heads moveable with respect to each other and with respect to the workpiece. The handling device includes a gripper mounted in a fixed or movable relation to the upper wire guiding head. The gripper moves so as to face a produced core piece with its gripper base. The gripper includes a fluid inlet where fluid flow under positive pressure enters the gripper and a fluid outlet at the gripper base where the fluid flow exits the gripper. An interior of the gripper guides the fluid flow, producing a low pressure region at the gripper base as the fluid flow exits, generating lifting force to remove the produced core piece from the workpiece by movement of the gripper.

A fixture for supporting a workpiece during a machining operation is disclosed. The fixture may include a seat configured to receive the workpiece. The fixture may further include a quick release lever mounted to the fixture and configured to displace the workpiece from the seat.