B24B1/04

Ultrasonic peening-type integrated machining method of cutting and extrusion

An ultrasonic peening-type integrated machining method for cutting and extrusion includes: applying transverse ultrasonic vibration or a vibration component, which is vertical to a cutting speed direction to a cutting tool on a machine tool; setting a cutting parameter and an ultrasonic vibration parameter such that a dynamic negative clearance angle is generated in a cutting procedure and a flank face of the cutting tool conducts ultrasonic peening extrusion on the surface of the workpiece; setting an extrusion overlap ratio; setting a wear standard of flank faces extruded by the cutting tool; controlling a vibration cutting trajectory phase difference of the cutting tool during two adjacent rotations; and turning on the machine tool in order to ensure that cutting and surface extrusion strengthening of the workpiece are completed in one procedure without separate strengthening procedures. The method conducts extrusion strengthening on the surface of the workpiece while cutting the workpiece.

METHOD FOR GRINDING AND/OR POLISHING A DEFECT AND DEVICE FOR CARRYING OUT THE METHOD

A method for grinding and/or polishing a defect in the surface coating of a workpiece involves holding a grinding or polishing disc held on a tool and guiding the disc with pressure over the defect with orbital, rotating and/or vibrating movements. The tool fitted with the grinding or polishing disc is moved over the defect automatically and in a computer-controlled manner based on a stored program, wherein the grinding or polishing disc is first guided along a concentrically inner grinding path relative to the defect and then without interruption is guided along a spiral grinding path to an outer concentric grinding path.

METHOD FOR GRINDING AND/OR POLISHING A DEFECT AND DEVICE FOR CARRYING OUT THE METHOD

A method for grinding and/or polishing a defect in the surface coating of a workpiece involves holding a grinding or polishing disc held on a tool and guiding the disc with pressure over the defect with orbital, rotating and/or vibrating movements. The tool fitted with the grinding or polishing disc is moved over the defect automatically and in a computer-controlled manner based on a stored program, wherein the grinding or polishing disc is first guided along a concentrically inner grinding path relative to the defect and then without interruption is guided along a spiral grinding path to an outer concentric grinding path.

SYSTEM, DEVICE AND METHOD FOR RECONDITIONING A SUBSTRATE SUPPORT

A treatment tool for reconditioning the top surfaces of a plurality of projections of a substrate support in a lithographic tool. The treatment tool includes a reconditioning surface which is rough relative to smoothed top surfaces of the projections and which reconditioning surface has material harder than that of the material of the top surfaces of the projections. A reconditioning method involves causing an interaction between the reconditioning surface of the treatment tool and the top surfaces of the projections of the substrate support, so as to leave these top surfaces rougher than they were prior to the interaction.

SYSTEM, DEVICE AND METHOD FOR RECONDITIONING A SUBSTRATE SUPPORT

A treatment tool for reconditioning the top surfaces of a plurality of projections of a substrate support in a lithographic tool. The treatment tool includes a reconditioning surface which is rough relative to smoothed top surfaces of the projections and which reconditioning surface has material harder than that of the material of the top surfaces of the projections. A reconditioning method involves causing an interaction between the reconditioning surface of the treatment tool and the top surfaces of the projections of the substrate support, so as to leave these top surfaces rougher than they were prior to the interaction.

SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK
20230415299 · 2023-12-28 · ·

A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.

SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK
20230415299 · 2023-12-28 · ·

A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.

DEVICES FOR SURFACE FINISHING OF PARTS
20210205947 · 2021-07-08 ·

A device (1) for surface finishing of parts comprising an annular container (2) configured to receive a plurality of working media and at least a part to be treated, the container (2) has a central axis (A) and a bottom surface (3); vibratory means (4) associated (2) with the container (2) to make it oscillate and configured to cause the part to circulate inside the container; the bottom surface (3) has a plurality of projections (5) configured to change the spatial orientation of the part as it moves thereon.

ULTRASONIC SUB-APERTURE POLISHING OF AN OPTICAL ELEMENT
20210016409 · 2021-01-21 ·

Aspects of an ultrasonic polishing system include an ultrasonic actuator and a polishing arm. The ultrasonic actuator is configured to generate ultrasonic vibrations and the polishing arm is coupled to the ultrasonic actuator. The polishing arm includes a horn and a polishing ball. The horn has a proximal end and a distal end. The proximal end is coupled to receive the ultrasonic vibrations and the horn is configured to propagate the ultrasonic vibrations from the proximal end to a distal end. The polishing ball is attached to the distal end of the horn, where the polishing ball vibrates in response to the ultrasonic vibrations for polishing a surface of an optical element. The polishing ball is configured to provide a polishing area on the surface of the optical element that is smaller than an aperture of the optical element.

ULTRASONIC SUB-APERTURE POLISHING OF AN OPTICAL ELEMENT
20210016409 · 2021-01-21 ·

Aspects of an ultrasonic polishing system include an ultrasonic actuator and a polishing arm. The ultrasonic actuator is configured to generate ultrasonic vibrations and the polishing arm is coupled to the ultrasonic actuator. The polishing arm includes a horn and a polishing ball. The horn has a proximal end and a distal end. The proximal end is coupled to receive the ultrasonic vibrations and the horn is configured to propagate the ultrasonic vibrations from the proximal end to a distal end. The polishing ball is attached to the distal end of the horn, where the polishing ball vibrates in response to the ultrasonic vibrations for polishing a surface of an optical element. The polishing ball is configured to provide a polishing area on the surface of the optical element that is smaller than an aperture of the optical element.