Methods of making metal bond abrasive articles via powder bed jetting are disclosed. Metal bond abrasive articles prepared by the method include abrasive articles having arcuate or tortuous cooling channels, abrasive segments, abrasive wheels, and rotary dental tools.

Methods of making metal bond abrasive articles via powder bed jetting are disclosed. Metal bond abrasive articles prepared by the method include abrasive articles having arcuate or tortuous cooling channels, abrasive segments, abrasive wheels, and rotary dental tools.

In embodiments of the present disclosure, a vibrator is used to generate a vibration wave with a variable frequency that can agitate and facilitate the circulation of the processing fluids, thereby enhancing the uniformity and efficiency of the resulting semiconductor device features, the vibrator may be a piezoelectric vibrator or other similar vibrators. In some embodiments, the vibration of the processing fluids can facilitate the processing fluids in circulating in and out of narrow channels or features, or the vibration of the processing fluids can facilitate the bubbling out of the microbubbles entrapped in the processing liquid or entrapped between the surface of the semiconductor wafer and the processing liquid. In another embodiment, the vibrations generated by the vibrator have vibration waves with a variable frequency to avoid resonance that may damage the semiconductor wafer and the features thereon.

In embodiments of the present disclosure, a vibrator is used to generate a vibration wave with a variable frequency that can agitate and facilitate the circulation of the processing fluids, thereby enhancing the uniformity and efficiency of the resulting semiconductor device features, the vibrator may be a piezoelectric vibrator or other similar vibrators. In some embodiments, the vibration of the processing fluids can facilitate the processing fluids in circulating in and out of narrow channels or features, or the vibration of the processing fluids can facilitate the bubbling out of the microbubbles entrapped in the processing liquid or entrapped between the surface of the semiconductor wafer and the processing liquid. In another embodiment, the vibrations generated by the vibrator have vibration waves with a variable frequency to avoid resonance that may damage the semiconductor wafer and the features thereon.

A system forms a part in an initial geometry (e.g., a sheet) into a desired geometry. The system includes a robot arm with an end effector, a model and a controller. The model receives an input geometry and an input parameter value indicating an interaction between the part and the end effector. The model determines an output geometry of the part based on the input geometry and the input parameter value. The controller receives the initial and desired geometries; applies the model to the initial geometry and to different input parameter values; based on output geometries of the model, determines a set of parameter values for controlling the robot arm; and controls the robot arm according to the determined set of parameter values to form the part into the desired geometry using the end effector.

A system forms a part in an initial geometry (e.g., a sheet) into a desired geometry. The system includes a robot arm with an end effector, a model and a controller. The model receives an input geometry and an input parameter value indicating an interaction between the part and the end effector. The model determines an output geometry of the part based on the input geometry and the input parameter value. The controller receives the initial and desired geometries; applies the model to the initial geometry and to different input parameter values; based on output geometries of the model, determines a set of parameter values for controlling the robot arm; and controls the robot arm according to the determined set of parameter values to form the part into the desired geometry using the end effector.

An ultrasonic peening-type integrated machining method for cutting and extrusion includes: applying transverse ultrasonic vibration or a vibration component, which is vertical to a cutting speed direction to a cutting tool on a machine tool; setting a cutting parameter and an ultrasonic vibration parameter such that a dynamic negative clearance angle is generated in a cutting procedure and a flank face of the cutting tool conducts ultrasonic peening extrusion on the surface of the workpiece; setting an extrusion overlap ratio; setting a wear standard of flank faces extruded by the cutting tool; controlling a vibration cutting trajectory phase difference of the cutting tool during two adjacent rotations; and turning on the machine tool in order to ensure that cutting and surface extrusion strengthening of the workpiece are completed in one procedure without separate strengthening procedures. The method conducts extrusion strengthening on the surface of the workpiece while cutting the workpiece.

An ultrasonic peening-type integrated machining method for cutting and extrusion includes: applying transverse ultrasonic vibration or a vibration component, which is vertical to a cutting speed direction to a cutting tool on a machine tool; setting a cutting parameter and an ultrasonic vibration parameter such that a dynamic negative clearance angle is generated in a cutting procedure and a flank face of the cutting tool conducts ultrasonic peening extrusion on the surface of the workpiece; setting an extrusion overlap ratio; setting a wear standard of flank faces extruded by the cutting tool; controlling a vibration cutting trajectory phase difference of the cutting tool during two adjacent rotations; and turning on the machine tool in order to ensure that cutting and surface extrusion strengthening of the workpiece are completed in one procedure without separate strengthening procedures. The method conducts extrusion strengthening on the surface of the workpiece while cutting the workpiece.

The present invention relates to a device for generating an ultrasonic vibration of a tool used for the ultrasonic machining of a workpiece and for measuring ultrasonic vibration parameters of the ultrasonic vibration of the tool having a tool holder for receiving the tool, an ultrasonic transducer in the tool holder for generating the ultrasonic vibration of the tool, a sensor mechanism in the tool holder for producing a sensor signal on the basis of the ultrasonic vibration of the tool, and a sensor signal evaluation device for evaluating the sensor signal.

The present invention relates to a device for generating an ultrasonic vibration of a tool used for the ultrasonic machining of a workpiece and for measuring ultrasonic vibration parameters of the ultrasonic vibration of the tool having a tool holder for receiving the tool, an ultrasonic transducer in the tool holder for generating the ultrasonic vibration of the tool, a sensor mechanism in the tool holder for producing a sensor signal on the basis of the ultrasonic vibration of the tool, and a sensor signal evaluation device for evaluating the sensor signal.