The present invention provides an apparatus for resurfacing a rotating elastomer substrate. The apparatus utilizes a motorized grinding wheel, said motorized grinding wheel rotating in a direction counter to the rotating elastomer substrate and having an axis of rotation parallel to the axis of rotation of the rotating elastomer substrate, wherein the perpendicular distance between the motorized grinding wheel and the rotating elastomer substrate is adjustable so as to control the amount of elastomer substrate that is removed; and a mount for said motorized grinding wheel, wherein said mount is located proximal to the rotating elastomer substrate that comprises a part of a production line and wherein the mount is capable of traversing parallel to the rotating elastomer substrate.

The present invention provides an apparatus for resurfacing a rotating elastomer substrate. The apparatus utilizes a motorized grinding wheel, said motorized grinding wheel rotating in a direction counter to the rotating elastomer substrate and having an axis of rotation parallel to the axis of rotation of the rotating elastomer substrate, wherein the perpendicular distance between the motorized grinding wheel and the rotating elastomer substrate is adjustable so as to control the amount of elastomer substrate that is removed; and a mount for said motorized grinding wheel, wherein said mount is located proximal to the rotating elastomer substrate that comprises a part of a production line and wherein the mount is capable of traversing parallel to the rotating elastomer substrate.

An alignment system for aligning an ingot of semiconductor or solar-grade material is provided. The alignment system includes a mounting block for attachment to the ingot, an optical device for aligning a predetermined centerline of the ingot with a reference line, and adjustable supports configured for supporting the ingot on at least four support points and configured to adjust the position of the ingot. The mounting block is movable between a horizontal position and a vertical position.

An alignment system for aligning an ingot of semiconductor or solar-grade material is provided. The alignment system includes a mounting block for attachment to the ingot, an optical device for aligning a predetermined centerline of the ingot with a reference line, and adjustable supports configured for supporting the ingot on at least four support points and configured to adjust the position of the ingot. The mounting block is movable between a horizontal position and a vertical position.

An electronic grade glass substrate is provided with a recess, channel or step in one surface, and a first chamfer between the side surface of the recess, channel or step and the one surface. The side and bottom surfaces of the recess, channel or step are mirror finished, and the first chamfer is mirror finished.

An electronic grade glass substrate is provided with a recess, channel or step in one surface, and a first chamfer between the side surface of the recess, channel or step and the one surface. The side and bottom surfaces of the recess, channel or step are mirror finished, and the first chamfer is mirror finished.

There is disclosed a grinding method of a honeycomb structure, wherein a grind processing member having an outer peripheral surface, a first grinding wheel tapered surface and a second grinding wheel tapered surface and rotating around a central axis grinds a joined honeycomb segment assembly rotating around a central axis, and the above respective surfaces of the grind processing member form a first ground region, a second ground region, a center ground surface, a first tapered surface and a second tapered surface, to prepare the honeycomb structure including a cylindrical honeycomb base material, and a ring-like bulge portion which surrounds an outer periphery of the honeycomb base material, protrudes from the outer periphery of the honeycomb base material toward the outside in a flange manner, and has the first tapered surface, the second tapered surface and the center ground surface.

There is disclosed a grinding method of a honeycomb structure, wherein a grind processing member having an outer peripheral surface, a first grinding wheel tapered surface and a second grinding wheel tapered surface and rotating around a central axis grinds a joined honeycomb segment assembly rotating around a central axis, and the above respective surfaces of the grind processing member form a first ground region, a second ground region, a center ground surface, a first tapered surface and a second tapered surface, to prepare the honeycomb structure including a cylindrical honeycomb base material, and a ring-like bulge portion which surrounds an outer periphery of the honeycomb base material, protrudes from the outer periphery of the honeycomb base material toward the outside in a flange manner, and has the first tapered surface, the second tapered surface and the center ground surface.

Grinding a rod-shaped welding electrode includes forming a contact line at a contact surface region of a rotating grinding tool, moving the rotating grinding tool and the welding electrode relative to one another in order to grind a surface of the welding electrode, pressing the welding electrode in an axial direction against an abrasive contact surface region of the rotating grinding tool, and, during relative movement between the rotating grinding tool and the welding electrode, moving the rotating grinding tool along a curved path in a plane of movement which extends transversely to the contact line and which includes a longitudinal axis of the welding electrode. A holder for the rotating grinding tool is arranged on a coupler mechanism which is provided with two actuating drives enabling the holder to be moved to any point within an operating range of a plane of movement.

Grinding a rod-shaped welding electrode includes forming a contact line at a contact surface region of a rotating grinding tool, moving the rotating grinding tool and the welding electrode relative to one another in order to grind a surface of the welding electrode, pressing the welding electrode in an axial direction against an abrasive contact surface region of the rotating grinding tool, and, during relative movement between the rotating grinding tool and the welding electrode, moving the rotating grinding tool along a curved path in a plane of movement which extends transversely to the contact line and which includes a longitudinal axis of the welding electrode. A holder for the rotating grinding tool is arranged on a coupler mechanism which is provided with two actuating drives enabling the holder to be moved to any point within an operating range of a plane of movement.