Embodiments of the present disclosure relate a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure provide a substrate transporter for use in a CMP tool. The transporter may be used transport and/or carry substrates among various polishers and cleaners in a CMP tool while preventing the substrates from drying out during transportation. By keeping surfaces of the substrates wet during substrate waiting time or idle time in the CMP tool, embodiments of the present disclosure prevent many types of defects, such as byproducts, agglomerated abrasives, pad debris, slurry residues, from accumulate on the substrate surface during CMP processing, thus improve yields and device performance.

A method of processing a wafer includes a cutting step of cutting the face side of the wafer with a cutting blade to form grooves therein along projected dicing lines, a first inspecting step of capturing an image of the grooves formed in the cutting step and inspecting a state of a chip in the captured image of the grooves, a protecting member sticking step of sticking a protective member to the face side of the wafer, a grinding step of holding the protective member side of the wafer on a chuck table and grinding a reverse side of the wafer to thin the wafer to a finished thickness, thereby dividing the wafer into device chips, a second inspecting step of capturing an image of the grooves exposed on the reverse side of the wafer and inspecting a state of a chip in the captured image of the grooves.

The aim of the present invention is to provide a processing device and a processing method, with which it is possible to improve processing accuracy. A processing device processes a work piece which integrally includes a plate-shaped first curved-surface section and a plate-shaped planar-surface section that extends from the edge of the first curved-surface section in a bending manner. Furthermore, the processing device includes a first clamp device which includes a contact part that makes contact with the first curved-surface section, and a pressing part that presses the first curved-surface section in the direction of the contact part, and which restricts movement of the first curved-surface section in the plate thickness direction; a second clamp device which is movable in the plate thickness direction of the planar-surface section and supports the planar-surface section; and a machining device which machines the first curved-surface section.

A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.

A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.

A wood sander for sanding a target object. The wood sander comprises a frame, an upper assembly, a lower assembly, a drive system and a plurality of sandpaper sheets. The drive system is configured for pulling the plurality of sandpaper sheets through a path. The path is configured to cause the plurality of sandpaper sheets to touch a portion of the target object as the drive system rotates the plurality of sandpaper sheets. The upper assembly comprises the drive system, and the plurality of sandpaper sheets. The lower assembly comprises a platform configured to hold the target object. The upper assembly and the lower assembly are attached to and supported by the frame.

A wood sander for sanding a target object. The wood sander comprises a frame, an upper assembly, a lower assembly, a drive system and a plurality of sandpaper sheets. The drive system is configured for pulling the plurality of sandpaper sheets through a path. The path is configured to cause the plurality of sandpaper sheets to touch a portion of the target object as the drive system rotates the plurality of sandpaper sheets. The upper assembly comprises the drive system, and the plurality of sandpaper sheets. The lower assembly comprises a platform configured to hold the target object. The upper assembly and the lower assembly are attached to and supported by the frame.

The present disclosure relates to a contiguous compression wire sprang polishing apparatus that continuously polishes end surfaces of compression wise springs (10) by upper and lower chain conveyers 100 and 200 and grinding units 300. The apparatus includes: two gaming units (300) each having a grindstone (350) to which rotational force of a motor (240) is transmitted through a gear box (260), the motor (240) having a rotary shaft being located above a central axis of the grindstone (350), and the two grinding units (300) being installed to be parallel and opposite to each other at opposite sides of a compression wire spring (10) fixed to the continuous compression wire spring polishing apparatus so as to polish opposite end surfaces of the compression wire spring (10); two hinge shafts (140), which are fixed at positions, which are spaced apart from grindstones in the lowest surface of the grinding units (300) by a predetermined distance, and which are inserted into and coupled to bearings, which are fixed to a body of the polishing apparatus; an upper guide (225) configured to prevent the compression wire spring (10) from springing out and a rod end fixing shaft (150) fixed to an end of the cylinder rod (170) of the pneumatic cylinder (180) inserted into and coupled to a bearing fixed at a position between the grindstone rotation shaft and the hinge shaft (140) in each of the grinding units (300). The grindstone rotation shaft of each of the grinding units (300) is turned into the vertical state or the horizontal state according to the forward and backward movements of the pneumatic cylinder (180), so that the two grindstones (350) of the grinding units (300), which are mounted to be parallel and opposite to each other, can be easily replaced.

The present disclosure relates to a contiguous compression wire sprang polishing apparatus that continuously polishes end surfaces of compression wise springs (10) by upper and lower chain conveyers 100 and 200 and grinding units 300. The apparatus includes: two gaming units (300) each having a grindstone (350) to which rotational force of a motor (240) is transmitted through a gear box (260), the motor (240) having a rotary shaft being located above a central axis of the grindstone (350), and the two grinding units (300) being installed to be parallel and opposite to each other at opposite sides of a compression wire spring (10) fixed to the continuous compression wire spring polishing apparatus so as to polish opposite end surfaces of the compression wire spring (10); two hinge shafts (140), which are fixed at positions, which are spaced apart from grindstones in the lowest surface of the grinding units (300) by a predetermined distance, and which are inserted into and coupled to bearings, which are fixed to a body of the polishing apparatus; an upper guide (225) configured to prevent the compression wire spring (10) from springing out and a rod end fixing shaft (150) fixed to an end of the cylinder rod (170) of the pneumatic cylinder (180) inserted into and coupled to a bearing fixed at a position between the grindstone rotation shaft and the hinge shaft (140) in each of the grinding units (300). The grindstone rotation shaft of each of the grinding units (300) is turned into the vertical state or the horizontal state according to the forward and backward movements of the pneumatic cylinder (180), so that the two grindstones (350) of the grinding units (300), which are mounted to be parallel and opposite to each other, can be easily replaced.

A machine (10) for grinding and/or polishing slabs of stone material, such as natural or agglomerated stone, ceramics or glass, comprises: a support bench (12) for the slabs to be machined. At least one working station (14) is provided above the support bench (12), said station comprising at least one pair of bridge support structures (16, 18) situated opposite each and arranged transversely on either side of the support bench (12). First means (19) are provided for performing a relative movement in the longitudinal direction of machining station (14) and slab on the support bench (12). The machine further comprises at least one beam (20, the two ends (22, 24) of which are supported by the support structures (16, 18), and at least one rotating spindle (26) with a sliding vertical axis mounted on the at least one beam (20). The beam (20) is movable transversely on the support structures (16, 18). The bottom end of the spindle (26) is provided with at least one tool-carrying support (28) rotating about the axis of rotation of the spindle (26). The machine is characterized in that it comprises second means (32) for performing a relative movement in the longitudinal direction of the at least one spindle (26) with respect to the support bench (12).