Embodiments of the present disclosure relate a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure provide a substrate transporter for use in a CMP tool. The transporter may be used transport and/or carry substrates among various polishers and cleaners in a CMP tool while preventing the substrates from drying out during transportation. By keeping surfaces of the substrates wet during substrate waiting time or idle time in the CMP tool, embodiments of the present disclosure prevent many types of defects, such as byproducts, agglomerated abrasives, pad debris, slurry residues, from accumulate on the substrate surface during CMP processing, thus improve yields and device performance.

The present invention relates to a grinding machine for grinding a metallic surface of a workpiece, wherein the grinding machine has at least one grinding apparatus, at least one grinding table (2) with at least one transport belt (4) for transporting the workpiece through the grinding machine, and a housing in which the grinding apparatus is arranged,
wherein the transport belt (4) is removable from the grinding machine, wherein the grinding apparatus and/or the grinding table (2) do not need to be removed from the grinding machine.

The present invention comprises a grinding machine for grinding a metallic surface of a workpiece, wherein the grinding machine has at least one grinding apparatus, at least one transport belt (2) for transporting the workpiece through the grinding machine, and at least one suction device by means of which a workpiece lying on the transport belt (2) can be acted on with a negative pressure,
wherein the suction device has an extraction chamber (14) which is arranged below the transport belt (2) and which has a base (16) which is inclined with respect to the horizontal.

An adaptable belt sander may comprise: a tool holder; a housing; a drive system comprising a first gear and a second gear configured to engage the first gear, the second gear coupled to a shaft; and a belt system comprising a belt extending from the shaft to a distal end of the adaptable belt sander, the adaptable belt sander configured to travel along a belt path in response to rotation of the shaft, the distal end having a rotating apparatus configured to engage the belt.

Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units (110) and (110) provided facing each other at positions spaced apart from each other. Each chain unit (110), (110) includes first V-shaped blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units (210) and (210) provided facing each other at positions spaced apart from each other. Each chain unit (210), (210) includes second V-shaped blocks (215) for compressing downward upper portions of the compression line springs seated on the first V-shaped blocks (115) and thus supporting the compression line springs. The grinding units (300) grind seat surfaces formed on opposite ends of the compression line springs that are being moved by the lower chain conveyor and the upper chain conveyor.

Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units (110) and (110) provided facing each other at positions spaced apart from each other. Each chain unit (110), (110) includes first V-shaped blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units (210) and (210) provided facing each other at positions spaced apart from each other. Each chain unit (210), (210) includes second V-shaped blocks (215) for compressing downward upper portions of the compression line springs seated on the first V-shaped blocks (115) and thus supporting the compression line springs. The grinding units (300) grind seat surfaces formed on opposite ends of the compression line springs that are being moved by the lower chain conveyor and the upper chain conveyor.

A device including a turning unit for turning a workpiece, the turning unit including a drivably movable turning body with a contact member that is movable along a curved movement path with the movement of the turning body, as well as a guide arrangement for guiding the workpiece during the turning operation which is positioned adjacent the contact member along the movement path such that during a turning operation, the contact member is movable into pressing contact with the workpiece in such a manner that during the turning operation, the workpiece is entrainable along the movement path.

A device including a turning unit for turning a workpiece, the turning unit including a drivably movable turning body with a contact member that is movable along a curved movement path with the movement of the turning body, as well as a guide arrangement for guiding the workpiece during the turning operation which is positioned adjacent the contact member along the movement path such that during a turning operation, the contact member is movable into pressing contact with the workpiece in such a manner that during the turning operation, the workpiece is entrainable along the movement path.

The invention relates to the technical field of wafer processing, and specifically discloses a wafer thinning system and a thinning method. The system includes a first transfer mechanism, a first conveying mechanism and a second transfer mechanism, as well as a rough grinding mechanism, a fine grinding mechanism and a detection mechanism disposed on the first conveying mechanism. The system further includes carrying mechanisms, a second conveying mechanism, and a controller. The controller is configured to control the first conveying mechanism to convey the carrying mechanisms and control the rough grinding mechanism, the fine grinding mechanism and the detection mechanism to sequentially perform rough grinding, fine grinding and thickness detection on the wafers. The system can implement rough grinding, fine grinding and thickness detection for the wafers, thereby implementing continuous thinning of the wafer and increasing the yield of wafer thinning.

The invention relates to the technical field of wafer processing, and specifically discloses a wafer thinning system and a thinning method. The system includes a first transfer mechanism, a first conveying mechanism and a second transfer mechanism, as well as a rough grinding mechanism, a fine grinding mechanism and a detection mechanism disposed on the first conveying mechanism. The system further includes carrying mechanisms, a second conveying mechanism, and a controller. The controller is configured to control the first conveying mechanism to convey the carrying mechanisms and control the rough grinding mechanism, the fine grinding mechanism and the detection mechanism to sequentially perform rough grinding, fine grinding and thickness detection on the wafers. The system can implement rough grinding, fine grinding and thickness detection for the wafers, thereby implementing continuous thinning of the wafer and increasing the yield of wafer thinning.