A disc-shaped grindstone 1 includes a plurality of split grindstones provided in an outer circumferential surface of a disc-shaped base 3. At least a part of the split grindstones include a moving grindstone 6 which is movable in the axial direction of the disc-shaped base 3. Since a part of the split grindstones 4 is the moving grindstone 6 which is movable in the axial direction, the width of the disc-shaped grindstone 1 may be changed in a manner such that the moving grindstone 6 is moved in the axial direction. Accordingly, it is possible to promptly handle a plurality of kinds of grinding targets without replacing the disc-shaped grindstone 1.

According to one embodiment, a method for handling congestion in a network includes determining that there is congestion on a first device in a network, setting a congestion indicator in a header of a packet to indicate an amount of congestion at the first device, sending the packet to all devices that send traffic to the first device, receiving the packet having the multi-bit indicator in a header thereof at a device that sends traffic to the first device, and reducing a congestion window by a factor of between about 5% and about 50% based on a severity of the congestion indicated by the multi-bit indicator, wherein the congestion window is reduced by a greater factor when the congestion is indicated as being more severe. Other systems and methods for handling congestion in a network are described according to more embodiments.

A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.

A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.

An oscillating sanding machine includes a base column, an oscillating sanding spindle, a conveying unit, a first driving unit, a second driving unit, and a third driving unit. The first driving unit is for driving a rotating shaft of the oscillating sanding spindle to rotate about an axis it extends and the second driving unit is for driving the oscillating sanding spindle to move to and fro along the axis and perform oscillation. The conveying unit is located under the oscillating sanding spindle and separated from the oscillating sanding spindle by a predetermined distance. The third driving unit is mounted on the base column and connected to the conveying unit, so as to drive the conveying unit. The oscillating sanding machine provides high-precision control and ensures surface uniformity of sanded workpieces.

An oscillating sanding machine includes a base column, an oscillating sanding spindle, a conveying unit, a first driving unit, a second driving unit, and a third driving unit. The first driving unit is for driving a rotating shaft of the oscillating sanding spindle to rotate about an axis it extends and the second driving unit is for driving the oscillating sanding spindle to move to and fro along the axis and perform oscillation. The conveying unit is located under the oscillating sanding spindle and separated from the oscillating sanding spindle by a predetermined distance. The third driving unit is mounted on the base column and connected to the conveying unit, so as to drive the conveying unit. The oscillating sanding machine provides high-precision control and ensures surface uniformity of sanded workpieces.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof, wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof, wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

An edge polishing system with an edge alignment function for plates, including an edge polishing machine and a plate feeding platform. The plate feeding platform includes a frame assembly, a conveyor belt mechanism, a lifting mechanism, a blocking mechanism and a plate pressing mechanism. The frame assembly includes a movable frame and a fixed frame articulated with the movable frame. The conveyor belt mechanism is arranged on the movable frame. The lifting mechanism is arranged between the movable frame and the fixed frame. The blocking mechanism is arranged on an end of the movable frame. The plate pressing mechanism is arranged above the conveyor belt mechanism.

Embodiments of the present disclosure relate a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure provide a substrate transporter for use in a CMP tool. The transporter may be used transport and/or carry substrates among various polishers and cleaners in a CMP tool while preventing the substrates from drying out during transportation. By keeping surfaces of the substrates wet during substrate waiting time or idle time in the CMP tool, embodiments of the present disclosure prevent many types of defects, such as byproducts, agglomerated abrasives, pad debris, slurry residues, from accumulate on the substrate surface during CMP processing, thus improve yields and device performance.