Patent classifications
B24B7/07
GRINDING APPARATUS
There is provided a grinding apparatus used at the time of grinding a workpiece. The grinding apparatus includes a chuck table that has a holding surface for holding the workpiece, a grinding unit that has a spindle to which a grinding wheel in which a plurality of grindstones are arrayed in an annular shape is mounted, and an exterior cover that includes an opening facing the grinding unit and a door capable of covering the opening and that covers both the chuck table and the grinding unit. In the grinding apparatus, on an inner surface of the door that faces the grinding unit in a closed state in which the opening is covered by the door, a work bench that is folded to prevent interference with the grinding unit in the closed state is provided.
SYSTEM, DEVICE AND METHOD FOR RECONDITIONING A SUBSTRATE SUPPORT
A treatment tool for reconditioning the top surfaces of a plurality of projections of a substrate support in a lithographic tool. The treatment tool includes a reconditioning surface which is rough relative to smoothed top surfaces of the projections and which reconditioning surface has material harder than that of the material of the top surfaces of the projections. A reconditioning method involves causing an interaction between the reconditioning surface of the treatment tool and the top surfaces of the projections of the substrate support, so as to leave these top surfaces rougher than they were prior to the interaction.
CHANNEL CUT POLISHING MACHINE
A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from said base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.
Wood sander
A wood sander for sanding a target object. The wood sander comprises a frame, an upper assembly, a lower assembly, a drive system and a plurality of sandpaper sheets. The drive system is configured for pulling the plurality of sandpaper sheets through a path. The path is configured to cause the plurality of sandpaper sheets to touch a portion of the target object as the drive system rotates the plurality of sandpaper sheets. The upper assembly comprises the drive system, and the plurality of sandpaper sheets. The lower assembly comprises a platform configured to hold the target object. The upper assembly and the lower assembly are attached to and supported by the frame.
Polishing device
A polishing device configured to polish a glass substrate is disclosed, including a polishing wheel fixedly arranged, a cooling pipe, and a movable platform. The polishing wheel has an outer peripheral polishing surface, the glass substrate is placed on the platform and is driven by the platform to move so as to make the outer peripheral polishing surface polish the predetermined polishing surface of the glass substrate; the polishing wheel further has a chamber, and the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make temperatures of the outer peripheral polishing surface and the predetermined polishing surface during polishing is lower than a preset temperature. The disclosure solves the problem of high polishing temperature of the polishing wheel and the glass substrate, thereby enhancing the service life of the polishing wheel and the yield of the glass substrate.
Polishing device
A polishing device configured to polish a glass substrate is disclosed, including a polishing wheel fixedly arranged, a cooling pipe, and a movable platform. The polishing wheel has an outer peripheral polishing surface, the glass substrate is placed on the platform and is driven by the platform to move so as to make the outer peripheral polishing surface polish the predetermined polishing surface of the glass substrate; the polishing wheel further has a chamber, and the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make temperatures of the outer peripheral polishing surface and the predetermined polishing surface during polishing is lower than a preset temperature. The disclosure solves the problem of high polishing temperature of the polishing wheel and the glass substrate, thereby enhancing the service life of the polishing wheel and the yield of the glass substrate.
Grinding machine with transverse moving unit
A grinding machine includes a base having a plate and a movable device which is connected to the plate. A driving unit is connected to one end of the base and includes having a first motor which has a hollow shaft. An oval hole is defined in the hollow shaft. A grinding unit is located across the top of the plate and includes a body and a grinding part. The grinding part is slidably connected to a slot of the body and has a shaft unit which is located in the oval hole of the hollow shaft. A transverse moving unit is connected to the grinding part and has a second driving motor. A cam link is connected between the driving motor and the grinding part. The grinding part is moved transversely relative to the plate by the cam link driven by the second driving motor.
Grinding machine with transverse moving unit
A grinding machine includes a base having a plate and a movable device which is connected to the plate. A driving unit is connected to one end of the base and includes having a first motor which has a hollow shaft. An oval hole is defined in the hollow shaft. A grinding unit is located across the top of the plate and includes a body and a grinding part. The grinding part is slidably connected to a slot of the body and has a shaft unit which is located in the oval hole of the hollow shaft. A transverse moving unit is connected to the grinding part and has a second driving motor. A cam link is connected between the driving motor and the grinding part. The grinding part is moved transversely relative to the plate by the cam link driven by the second driving motor.
Channel cut polishing machine
A device for polishing of a multi-surface workpiece is described. The device includes a base and a vertical motion platform that moves along two support rods, which carries a motor that drives a rotating shaft. The support rods extend from the base. A polishing tool is attached to the motor shaft. The workpiece being polished is placed on a linear motion stage during the polishing process.
Method for producing substrate
There is furnished a working tool comprising a rotating shaft (6), a polishing plate (3) mounted on the shaft, an expandable elastomer sheet (4) attached to the polishing plate (3), an abrasive cloth (5) attached to the elastomer sheet (4), and means for pressing the elastomer sheet (4) at a plurality of positions under respective predetermined different pressures such that a lower surface of the abrasive cloth (5) is deformed to the desired inverted convex shape in accordance with differences of pressing force applied to the elastomer sheet (4) at the plurality of positions. A substrate is produced by bringing the inverted convexly deformed surface of the abrasive cloth (5) in contact with a substrate stock, and rotating and moving the working tool for polishing the substrate over a selected area.