There is furnished a working tool comprising a rotating shaft (6), a polishing plate (3) mounted on the shaft, an expandable elastomer sheet (4) attached to the polishing plate (3), an abrasive cloth (5) attached to the elastomer sheet (4), and means for pressing the elastomer sheet (4) at a plurality of positions under respective predetermined different pressures such that a lower surface of the abrasive cloth (5) is deformed to the desired inverted convex shape in accordance with differences of pressing force applied to the elastomer sheet (4) at the plurality of positions. A substrate is produced by bringing the inverted convexly deformed surface of the abrasive cloth (5) in contact with a substrate stock, and rotating and moving the working tool for polishing the substrate over a selected area.

A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.

The present invention relates to a retainer ring structure for a CMP apparatus and a method for manufacturing the same. The retainer ring structure may include screws for fixing the retainer ring structure mounted on a polishing head during a CMP process, the screw being made of a high-strength metallic material, and the method for manufacturing the retainer ring structure may be simplified. Thus, a coupling force with the polishing head may be increased to reduce a defect rate, and the process may be simplified to reduce an operation time and a manufacturing cost, thereby increasing merchantability.

The present invention relates to a retainer ring structure for a CMP apparatus and a method for manufacturing the same. The retainer ring structure may include screws for fixing the retainer ring structure mounted on a polishing head during a CMP process, the screw being made of a high-strength metallic material, and the method for manufacturing the retainer ring structure may be simplified. Thus, a coupling force with the polishing head may be increased to reduce a defect rate, and the process may be simplified to reduce an operation time and a manufacturing cost, thereby increasing merchantability.

A floor leveling apparatus and method for cutting parallel grooves in a hardened body which is configured to assist in utilizing a grinder to finish surfaces in a planar manner.

A substrate cleaning member includes: a first member including a first contact surface, wherein the first member is configured to clean or polish a main surface of a substrate by moving the first contact surface along the main surface while the first contact surface is in contact with the main surface; a second member including a second contact surface, wherein the second member is configured to clean the main surface by moving the second contact surface along the main surface while the second contact surface is in contact with the main surface; a lower-layer member configured to support the second member such that the second contact surface protrudes beyond the first contact surface in an axial direction in which the predetermined axis extends; and a base configured to support the first member, the second member and the lower-layer member.

A substrate cleaning member includes: a first member including a first contact surface, wherein the first member is configured to clean or polish a main surface of a substrate by moving the first contact surface along the main surface while the first contact surface is in contact with the main surface; a second member including a second contact surface, wherein the second member is configured to clean the main surface by moving the second contact surface along the main surface while the second contact surface is in contact with the main surface; a lower-layer member configured to support the second member such that the second contact surface protrudes beyond the first contact surface in an axial direction in which the predetermined axis extends; and a base configured to support the first member, the second member and the lower-layer member.

A grinding mechanism is provided including a support table configured for fixing a workpiece to be ground thereon, and a sliding assembly slidably provided on the support table and including a cleaning tool. The cleaning tool includes a scraper configured to face the support table and a scraper holder to which the scraper is provided.

A fine adjustment thread assembly couples a first part and a second part to each other while keeping the first part and the second part spaced apart, adjusts the distance between the first part and the second part, and detects a load applied to the second part. The assembly includes first external threads that can be brought into threaded engagement with first internal threads formed in the first part, second external threads that are axially spaced from the first external threads, that have a thread pitch different from that of the first internal thread, and that can be brought into threaded engagement with second internal threads formed in the second part. A joint portion between the first external threads and the second external threads houses a load sensor under a compressive load.

A grinding machine includes a base having a plate and a movable device which is connected to the plate. A driving unit is connected to one end of the base and includes having a first motor which has a hollow shaft. An oval hole is defined in the hollow shaft. A grinding unit is located across the top of the plate and includes a body and a grinding part. The grinding part is slidably connected to a slot of the body and has a shaft unit which is located in the oval hole of the hollow shaft. A transverse moving unit is connected to the grinding part and has a second driving motor. A cam link is connected between the driving motor and the grinding part. The grinding part is moved transversely relative to the plate by the cam link driven by the second driving motor.