B24B7/10

METHOD AND DEVICE FOR REMOVING MATERIAL FROM A SUBSTRATE

A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.

Rotating tool, and polishing tool

A rotating tool includes a tool body including a polishing tool and a shank, and a flange part provided in the tool body. The polishing tool includes a plurality of linear grinding members and a grinding member holder to hold the linear grinding members. The flange part is an annular member, and attached to the grinding member holder, so as to be movable in the direction of an axial line and rotatable about the axial line. When the inner circumferential surface of a hole formed in a workpiece is processed, the grinding member holder and the annular member are inserted into the hole. When run-out on the front side of the rotating tool occurs, the annular member comes into contact with the peripheral wall surface of the hole, whereby the run-out of the tool body is reduced.

Rotating tool, and polishing tool

A rotating tool includes a tool body including a polishing tool and a shank, and a flange part provided in the tool body. The polishing tool includes a plurality of linear grinding members and a grinding member holder to hold the linear grinding members. The flange part is an annular member, and attached to the grinding member holder, so as to be movable in the direction of an axial line and rotatable about the axial line. When the inner circumferential surface of a hole formed in a workpiece is processed, the grinding member holder and the annular member are inserted into the hole. When run-out on the front side of the rotating tool occurs, the annular member comes into contact with the peripheral wall surface of the hole, whereby the run-out of the tool body is reduced.

Abrasive material

The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size D.sub.SEM of the longitudinal axis of the observed particles is 1.0 m or less, and if the particle size D.sub.50 of the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 m or less.

Abrasive material

The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size D.sub.SEM of the longitudinal axis of the observed particles is 1.0 m or less, and if the particle size D.sub.50 of the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 m or less.

COATING REMOVAL APPARATUS AND METHOD

A coating removal apparatus includes multiple pairs of rotatable brushes spaced apart from each other in a first direction. Each pair of brushes may include two opposing brushes that are configured to rotate about a common axis and move towards and away from each other in a second direction transverse to the first direction. When a coated panel is positioned between the two opposing brushes, first portions of the brushes may separably engage with and rotate on opposite surfaces of the coated panel. The apparatus may also include one or more liquid tanks configured to contain a liquid. When the tanks contain the liquid and when the coated panel is positioned between the two opposing brushes, second portions of the two brushes may at least contact the liquid in the liquid tanks.

COATING REMOVAL APPARATUS AND METHOD

A coating removal apparatus includes multiple pairs of rotatable brushes spaced apart from each other in a first direction. Each pair of brushes may include two opposing brushes that are configured to rotate about a common axis and move towards and away from each other in a second direction transverse to the first direction. When a coated panel is positioned between the two opposing brushes, first portions of the brushes may separably engage with and rotate on opposite surfaces of the coated panel. The apparatus may also include one or more liquid tanks configured to contain a liquid. When the tanks contain the liquid and when the coated panel is positioned between the two opposing brushes, second portions of the two brushes may at least contact the liquid in the liquid tanks.

Travel path grinding and travel path grinding method

A grinding device of a travel path, on which traveling wheels of a rail-type vehicle roll, includes a grinder which grinds a surface layer of a travel path, a frame on which the grinder is provided, and a device traveling wheel mounted on the frame. The device traveling wheel rolls along the travel path on the top surface of the standard rail extending in the extending direction of the travel path.

Travel path grinding and travel path grinding method

A grinding device of a travel path, on which traveling wheels of a rail-type vehicle roll, includes a grinder which grinds a surface layer of a travel path, a frame on which the grinder is provided, and a device traveling wheel mounted on the frame. The device traveling wheel rolls along the travel path on the top surface of the standard rail extending in the extending direction of the travel path.

Method and device for removing material from a substrate

A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.