A system and method for imparting a textured surface effect in a board. The system and method are configured to releasably secure a charge on a table; determine a random abrasion pattern for the charge with at least one programmable controller; and control at least one abrasion assembly with the at least one programmable controller in accord with the random abrasion pattern to selectively engage and remove desired portions of the upper surface of the charge with the at least one abrasion assembly to form a randomized textured surface effect thereon.

A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.

A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.

The invention provides a cloth taking-up device including: a platform, on which glue/cloth to be taken-up are disposed; and a clamp part movable with respect to the platform, which can clamp a roller and roll the glue/cloth to be taken-up successively onto the roller. An outside surface of the platform has an included angle of 0-180 with respect to the horizontal plane, on which the glue/cloth to be taken-up are disposed, and the clamp part can keep the roller in parallel with the outside surface. The cloth taking-up device can avoid uneven pressure applied to the glue/cloth to be taken-up in the down-press manner, improving uniformity of taken-up glue/cloth. Meanwhile, the foreign matters on the glue/cloth to be taken-up can easily fall off, and the foreign matters on the rollers cannot drop onto the glue/cloth to be taken-up with the rotation, thereby ensuring glue/cloth taking-up quality.

The invention provides a cloth taking-up device including: a platform, on which glue/cloth to be taken-up are disposed; and a clamp part movable with respect to the platform, which can clamp a roller and roll the glue/cloth to be taken-up successively onto the roller. An outside surface of the platform has an included angle of 0-180 with respect to the horizontal plane, on which the glue/cloth to be taken-up are disposed, and the clamp part can keep the roller in parallel with the outside surface. The cloth taking-up device can avoid uneven pressure applied to the glue/cloth to be taken-up in the down-press manner, improving uniformity of taken-up glue/cloth. Meanwhile, the foreign matters on the glue/cloth to be taken-up can easily fall off, and the foreign matters on the rollers cannot drop onto the glue/cloth to be taken-up with the rotation, thereby ensuring glue/cloth taking-up quality.

A grinding apparatus includes a holding table for holding a wafer, a support table for supporting the holding table, a motor for rotating the support table, a frame member supporting the support table for rotation, and at least three support poles for supporting the frame member from the base. Each of the support poles has formed in the inside thereof a through-hole, a supply port which communicates the through-hole and an air supply source with each other, and an exhaust port which exhausts air having flowed through the through-hole toward the support table. Air is supplied into the through-hole to cool the support pole, and the air having flowed through the through-hole is exhausted toward the support table.

A grinding apparatus includes a holding table for holding a wafer, a support table for supporting the holding table, a motor for rotating the support table, a frame member supporting the support table for rotation, and at least three support poles for supporting the frame member from the base. Each of the support poles has formed in the inside thereof a through-hole, a supply port which communicates the through-hole and an air supply source with each other, and an exhaust port which exhausts air having flowed through the through-hole toward the support table. Air is supplied into the through-hole to cool the support pole, and the air having flowed through the through-hole is exhausted toward the support table.

A substrate processing apparatus includes a film forming device configured to form a film on a non-bonding surface of a second substrate, which has a bonding surface bonded to a first substrate to be thinned and the non-bonding surface opposite to the bonding surface; and a controller configured to control the film forming device. The controller performs a control of forming the film on a portion of the non-bonding surface or forming the film thicker on a portion of the non-bonding surface than on another portion thereof, based on a thickness distribution of the second substrate.

A substrate processing apparatus includes a film forming device configured to form a film on a non-bonding surface of a second substrate, which has a bonding surface bonded to a first substrate to be thinned and the non-bonding surface opposite to the bonding surface; and a controller configured to control the film forming device. The controller performs a control of forming the film on a portion of the non-bonding surface or forming the film thicker on a portion of the non-bonding surface than on another portion thereof, based on a thickness distribution of the second substrate.

A machining machine comprises a first support disk, a first working disk coupled to the first support disk, and a counter bearing element positioned to define a working gap between the first working disk and the counter bearing element. The first working disk and the counter bearing element are configured to rotate relative to each other to machine at least one side of a flat workpiece. A pressure volume is positioned between the first support disk and the first working disk and is configured to hold a pressure fluid, which generates a pressure configured to deform the first working disk. One or more temperature-controlling channels are positioned within the first working disk and configured to hold a temperature-controlling fluid that is configured to control a temperature of the first working disk, wherein the one or more temperature-controlling channels are fluidly separate from the pressure volume.