A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.

Provided are a quartz glass member with an increased exposure area, which has an increased exposure area to a film formation treatment gas as compared to a member having a flat surface and has the increased exposure area controlled so that a constant adsorption amount of the film formation treatment gas onto a surface thereof is achieved, a method for manufacturing the quartz glass member with an increased exposure area, and a blade with multiple peripheral cutting edges to be used for the method. The quartz glass member with an increased exposure area is a quartz glass member for exposure to a film formation treatment gas to be, in film formation treatment of a semiconductor substrate, placed in a reaction chamber together with the semiconductor substrate to be subjected to the film formation treatment and exposed to the film formation treatment gas, the quartz glass member including: a quartz glass member main body; and a plurality of irregularities formed on a surface of the quartz glass member main body, the exposure area of the quartz glass member to the film formation treatment gas being controlled and increased.

Wheel back cavity groove processing equipment is disclosed in the present application, which includes a lower lifting system, a central brush system, groove brush systems, a synchronous clamping and rotating system, a left brush system, a right brush system, an upper lifting system and the like. The wheel back cavity groove processing equipment not only may be used for removing burrs from wheel back cavity grooves, but also may be used for removing burrs from bolt holes, a center hole, spoke edges and transverse corners, and simultaneously has the characteristics of high automation degree, high removal efficiency, advanced process, strong generality, and high safety and stability.

Wheel back cavity groove processing equipment is disclosed in the present application, which includes a lower lifting system, a central brush system, groove brush systems, a synchronous clamping and rotating system, a left brush system, a right brush system, an upper lifting system and the like. The wheel back cavity groove processing equipment not only may be used for removing burrs from wheel back cavity grooves, but also may be used for removing burrs from bolt holes, a center hole, spoke edges and transverse corners, and simultaneously has the characteristics of high automation degree, high removal efficiency, advanced process, strong generality, and high safety and stability.

Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

Particular embodiments of the inventive technology relate to apparatus and methods for cutting multi-layered material to reconfigure it so it may be used to construct sub-compartments in a larger storage container. The inventive technology, in particular embodiments may feature one or more of the following: dual blades, staggered blades (where one blade is more forward than another), a blade(s) angled upwards and forwards, blades separated in a left-right direction, prong recesses to accept trailing tips of blades, a rearwardly angled handle and/or a removed material ejection ramp, in conjunction perhaps with other features such as, e.g., a guide prong. One or more of such features may appear in the various manifestations of a defluting cutter or through cutting apparatus, whether guided or unguided, and/or manual or powered.

Device and method for the finishing machining of an internal face of a workpiece, such as the track of a ball screw, including a workpiece holder and a finishing tool held on a finishing tool holder. A rotary drive is provided, by which the workpiece holder and the finishing tool is rotationally driven relative to one another about a rotational axis. A linear drive is provided, by which the finishing tool held on the finishing tool holder and the workpiece holder is driven in a translatory manner relative to one another along the rotational axis. An oscillating drive is provided, by which the finishing tool held on the finishing tool holder and the workpiece holder is driven in an oscillating manner relative to one another in the direction parallel to the rotational axis and wherein the finishing tool is pivotably held on the finishing tool holder about a pivot axis.

Device and method for the finishing machining of an internal face of a workpiece, such as the track of a ball screw, including a workpiece holder and a finishing tool held on a finishing tool holder. A rotary drive is provided, by which the workpiece holder and the finishing tool is rotationally driven relative to one another about a rotational axis. A linear drive is provided, by which the finishing tool held on the finishing tool holder and the workpiece holder is driven in a translatory manner relative to one another along the rotational axis. An oscillating drive is provided, by which the finishing tool held on the finishing tool holder and the workpiece holder is driven in an oscillating manner relative to one another in the direction parallel to the rotational axis and wherein the finishing tool is pivotably held on the finishing tool holder about a pivot axis.

The invention has a turnback roll which can transfer and guide a polishing tap in a tangential direction of a pressure contacting roll, a vertical oscillation mechanism which linearly oscillates the pressure contacting roll in a tangential direction of a ball groove while being orthogonal to a rotating axis line, and a horizontal oscillation mechanism which linearly oscillates the pressure contacting roll in a direction of a rotating axis line toward both inner side surfaces of the ball groove. The ball groove can be securely polished by the polishing tape on the basis of the continuous or intermittent transfer of the polishing tape and the linear oscillating motion of the ball groove. It is possible to improve a polishing precision, it is possible to improve a surface roughness of the ball groove and it is possible to improve a polishing workability of the ball groove.