A combined additive manufacturing method applicable to parts and molds relates to moldless-growth manufacturing of parts and molds, which includes steps of: S1: layering and slicing a three-dimensional CAD (computer-aided design) model of a workpiece to be formed according to shape, thickness and dimensional accuracy requirements of the workpiece, so as to obtain a plurality of layered slice data; S2: planning a forming path according to the layered slice data, and generating layered slice numerical control codes for forming; and S3: deposition-forming a powder material on a substrate layer-by-layer and performing pressure forming or milling forming according to the layered slice numerical control codes in the step S2, which uses a numerically controlled high-speed cold spray gun to spray the powder material to a determined position for deposition-forming. The method of the present invention overcomes thermally induced adverse effects of hot processing and drawbacks of cold spray deposition.

A method of processing at least one ferrule is disclosed. The at least one ferrule includes an end face. The method includes engaging the end face of the at least one ferrule and an abrasive element with each other at the mating interface; moving the at least one ferrule and the abrasive element relative to each other; and tracing a spiral path in the abrasive element due to the relative movement between the at least one ferrule and the abrasive element. An apparatus for carrying out the method is also disclosed.

A method of processing a ferrule end face using at least one grinding wheel rotatable about a central axis and having a working surface with an abrasive element is provided. The method includes holding the ferrule stationary, engaging the end face of the ferrule and the working surface of the at least one grinding wheel, rotating the at least one grinding wheel about the central axis, and moving the at least one grinding wheel relative to the ferrule along a curve perpendicular to the central axis. Processing the ferrule in this manner imparts a convex shape of the end face of the ferrule. An apparatus for carrying out the method is also disclosed.

A tool for chamfering cleaved tips of optical fibers. The tool including conical bores of relatively smooth and hard material terminate at a cylindrical bore that is slightly larger than the fiber core maximum diameter and a fiber centering bore that is slightly larger than the fiber coating maximum diameter. The tool provided such that when a cleaved fiber tip is inserted into the centering bore the sharp edge falls upon the chamfer that, when rotated relative to the fiber, gently grinds the edge to the chamfer angle. Chamfering cannot occur on the core face due to the absence of tool surface at this dimension.

A method of processing a SiC ingot includes a resistance value measuring step of measuring an electric resistance value of an end face of the SiC ingot, a laser beam output adjusting step of adjusting the output of a laser beam according to the electric resistance value measured in the resistance value measuring step, and a peeling belt forming step in which, while a laser beam of such a wavelength as to be transmitted through the SiC ingot is being applied to the SiC ingot with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be formed, the SiC ingot and the focal point are put into relative processing feeding in an X-axis direction to form a belt-shaped peeling belt in the inside of the SiC ingot.

A method of processing a SiC ingot includes a resistance value measuring step of measuring an electric resistance value of an end face of the SiC ingot, a laser beam output adjusting step of adjusting the output of a laser beam according to the electric resistance value measured in the resistance value measuring step, and a peeling belt forming step in which, while a laser beam of such a wavelength as to be transmitted through the SiC ingot is being applied to the SiC ingot with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be formed, the SiC ingot and the focal point are put into relative processing feeding in an X-axis direction to form a belt-shaped peeling belt in the inside of the SiC ingot.

The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, the polishing machine comprising a polishing disk (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for receiving an abrasive, a positioning device (17) for relative positioning of the polishing disk and of the polishing platform between a polishing position and a set-up position (16), and a drive device for executing a relative polishing movement between the polishing platform and the polishing disk in the polishing position, the positioning device having a holder (20) for detachably holding the polishing disk, wherein the polishing machine has a metering device for applying a rinsing liquid to the polishing platform, a passage opening through which the rinsing liquid is metered onto the polishing platform by means of the metering device being formed in the polishing disk.

The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, the polishing machine comprising a polishing disk (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for receiving an abrasive, a positioning device (17) for relative positioning of the polishing disk and of the polishing platform between a polishing position and a set-up position (16), and a drive device for executing a relative polishing movement between the polishing platform and the polishing disk in the polishing position, wherein the polishing machine has a cleaning device for applying dry ice to the polishing platform and/or to the polishing disk.

A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.

An optical fiber polisher includes a polishing mechanism, a platen, and a memory for storing operational parameters entered by a user. The optical fiber polisher includes a processor to control a pressure applied by the polishing mechanism and a rotational speed of the platen, including causing a ramping down of at least one of the pressure and the rotational speed based on the operational parameters.