A method of finishing a laminated glass structure (102) comprising a flexible glass sheet (130) having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate (116) by an adhesive layer (135) is provided. The method includes applying a compressive force against a cut edge (106) of the flexible glass sheet (130) using an abrasive surface (108) of a hand-held finishing tool (105). Material of the laminated glass structure (102) is removed at the cut edge (106) such that a glass edge strength of the flexible glass sheet (130) is at least about 50 MPa.

To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing.

The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.

A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.

A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.

A tool sharpener has a guide assembly to support a cutting tool adjacent an abrasive medium. A drive assembly advances the abrasive medium with respect to the guide assembly. A control mechanism provides a first control input value to move the medium and achieve a first material take off (MTO) rate during a coarse sharpening operation upon the tool. A second control input value from the control circuit moves the medium to achieve a lower, second MTO rate during a fine sharpening operation. The control mechanism transitions the medium from the first MTO rate to the second MTO rate responsive to a timer mechanism indicating a conclusion of a predetermined elapsed time interval.

The present invention relates to a polishing apparatus and a polishing method. The polishing apparatus includes a holding stage (4), a polishing head (14), and a control device (1). The control device (1) includes a determination section (1d) that determines a removal of the film (F). The determination unit (1d) determines the removal of the film (F) when a rotational torque value is stabilized at a set torque value.

A blade for a skate for skating on ice. The blade includes ice-contacting material with an ice-contacting surface for contacting the ice. The ice-contacting surface has a machined longitudinal profile with a radius of curvature that varies smoothly over a majority of the length of the blade. Such a radius of curvature may, in some cases, be an elliptical arc.

A substrate processing apparatus includes: a substrate holder (5) having a suction holding surface (5a) configured to hold a first surface (2a) of a substrate (W); a processing head (7) arranged to process an outer circumferential portion of the substrate (W); a hydrostatic plate (9) having a fluid support surface (9a) facing the suction holding surface (5a); and a fluid supply line (10) coupled to the hydrostatic plate (9) and configured to supply fluid to a space between the fluid support surface (9a) and a second surface (2b) of the substrate (W). The second surface (2b) is an opposite side of the substrate (W) from the first surface (2a). The fluid support surface (9a) is larger than the suction holding surface (5a).

Some embodiments are directed to a wafer polishing tool. The wafer polishing tool includes a first polisher, a second polisher downstream of the first polisher, a third polisher downstream of the second polisher, and a fourth polisher downstream of the third polisher. The first polisher receives a wafer having a front side and a back side with integrated circuit component devices disposed on the front side of the wafer, and polishes a center region on the back side of the wafer. The second polisher receives the wafer via transporting equipment and buffs the center region of the back side of the wafer. The third polisher receives the wafer via the transporting equipment and polishes a back side edge region of the wafer. The fourth polisher receives the wafer via the transporting equipment and buffs the back side edge region of the wafer.

Method and apparatus for sharpening a cutting tool. In some embodiments, a sharpener has a guide assembly adjacent a moveable abrasive medium. The medium is advanced at a first speed relative to the guide assembly during a coarse sharpening operation in which a user presents the cutting tool against the medium to shape a side of the cutting tool and generate distended material from the cutting edge (e.g., burrs). The medium is subsequently slowed to a lower, second speed for a fine sharpening operation in which the user presents the cutting tool against the medium to remove the distended material and provide a sharpened cutting edge.