The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

A finishing device for finish machining of a workpiece, in particular of a crankshaft or a camshaft, comprising a workpiece holder and a rotary drive for rotating the workpiece about the workpiece axis thereof, comprising at least one first finishing tool for machining a main bearing concentric to the workpiece axis and at least one second finishing tool for machining an additional bearing, wherein the finishing tools can be moved along a transport axis which extends via a working area defined by the workpiece holder so that the finishing tools can be moved into an additional area arranged outside the working area.

A wheel grinding device consists of a lower lifting rotary system, spoke grinding units, a center hole grinding system and an upper lifting and clamping rotary system. The wheel grinding device not only can be used for grinding the center hole of a wheel of any size, but also can be used for grinding the back of wheel spokes of different sizes and shapes via the actions of brush belts.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof; wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).

A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

A method for operating a grinding device includes grinding of a surface of the workpiece with at least one grinding medium. Actual data is recorded on a data collection device during grinding with the at least one grinding medium. The actual data is then compared with target data stored in an electronic memory in an electronic data processing device. From this comparison, a determination is made of the exchange time at which the at least one grinding medium is to be changed.

Wheel back cavity groove processing equipment is disclosed in the present application, which includes a lower lifting system, a central brush system, groove brush systems, a synchronous clamping and rotating system, a left brush system, a right brush system, an upper lifting system and the like. The wheel back cavity groove processing equipment not only may be used for removing burrs from wheel back cavity grooves, but also may be used for removing burrs from bolt holes, a center hole, spoke edges and transverse corners, and simultaneously has the characteristics of high automation degree, high removal efficiency, advanced process, strong generality, and high safety and stability.

A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

A workpiece reverse support device has a pair of workpiece pinching members for abutting on their respective opposing side portions of the workpiece held by the robot hand so as to pinch the workpiece and a pinching state switching unit for switching the pair of workpiece pinching members between a pinching state of pinching the workpiece and a releasing state of releasing the workpiece. In a workpiece reverse support device for supporting a face/back reverse of a workpiece in a robot hand, flexibility of its installation state, namely installation location, installation posture, or the like can be enhanced.