The present invention provides a wheel burr removing device, which includes a frame, cylinders, guide posts, brush systems I, brush systems II and a clamping rotating system. The device in the present invention not only can be used for adjusting the angles of brushes II according to the size and the shape of the wheel so as to focus on removing burrs at the root of the rim, but also can be used for specifically removing burrs at the roots of flanges and the middle parts of spokes; meanwhile, the device has the characteristics of high automation degree, advanced process, simple structure and high safety and stability.

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.

The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).

Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

A device for recognising a sheet metal processing means in a sheet metal processing machine includes: an RFID unit for receiving a read signal of an RFID reader with information on an RFID transponder affixed on a sheet metal processing means at a sheet metal processing station in the sheet metal processing machine; an evaluation unit for determining sheet metal processing means data with information on the sheet metal processing means based on the read signal; and a machine interface for controlling a machine system of the sheet metal processing machine based on the sheet metal processing means data.

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).

A polisher includes a wafer carrier, a polishing head, a movement mechanism, and a rotation mechanism. The wafer carrier has a supporting surface. The supporting surface is configured to carry a wafer thereon. The polishing head is present above the wafer carrier. The polishing head has a polishing surface. The polishing surface of the polishing head is smaller than the supporting surface of the wafer carrier. The movement mechanism is configured to move the polishing head relative to the wafer carrier. The rotation mechanism is configured to rotate the polishing head relative to the wafer carrier.

An abrasive belt grinding center applicable to grinding and polishing of a whole profile of a blisk is provided, an X-axis feed mechanism, a Y-axis feed mechanism, a Z-axis feed mechanism, a B-axis rotation mechanism and a C-axis rotation mechanism constitute a grinding head feed mechanism, and a housing, a drum, a synchronous driven pulley, a synchronous belt, a synchronous driving pulley, and a grinding head rotation driving motor constitute a grinding head rotation mechanism. In the present application, two grinding heads are utilized to reasonably assign the machining angle and the feeding, and rough machining and fine machining can be both realized by one time of clamping, and the combination of six degrees of freedom in space is achieved by a short drive chain, and further the rigidities of a grinding head mechanism and a workpiece clamping mechanism are ensured.

A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishing a peripheral portion of the substrate by pressing a polishing tape having abrasive grains against the peripheral portion of the substrate with a first head, cleaning the peripheral portion of the substrate by supplying a cleaning liquid to the peripheral portion of the substrate after polishing, bringing a tape having no abrasive grains into contact with the peripheral portion of the substrate after cleaning by a second head, applying light to the tape and receiving reflected light from the tape by a sensor, and judging that the peripheral portion of the substrate is contaminated when an intensity of the received reflected light is lower than a predetermined value.

Disclosed herein are an apparatus of manufacturing a panel for home appliance by performing uniform surface processing on the panel and a method of manufacturing a home appliance by performing uniform surface processing on a panel. The apparatus of manufacturing a panel for home appliance includes a contacting roller configured to perform surface-processing on a panel that is to be processed; a pressing roller configured to press the panel toward the contacting roller; and a supporting roller configured to support a center middle portion of the contacting roller.