According to one embodiment, there is provided a top ring for holding a substrate. The top ring comprises a substrate supporting surface, a retainer member disposed to surround an outer periphery of the substrate supporting surface, and a retainer guiding device configured to guide the retainer member so as to allow the retainer member to be displaced in a direction perpendicular to the substrate supporting surface, and support the retainer member so as to inhibit the retainer member from being displaced in a direction parallel to and away from the substrate supporting surface. The retainer guiding device is disposed in an inner side of the retainer member surrounding the substrate supporting surface.

An apparatus for performing chemical mechanical planarization is disclosed. The apparatus includes a support, wherein an axis of rotation extends through the support. The apparatus includes at least one elongated member including a first portion and a second portion opposed to the first portion. The first portion is configured to rotatably connect to the support and pivot the elongated member about the axis of rotation relative to the support through an angle of rotation that is at least about 270 degrees in a single direction. The apparatus includes a carrier head configured to connect to the second portion and to hold and process a substrate.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first processing line and the second processing line, and a first retransfer robot configured to transfer a substrate from the front-end module to the first stage.

A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.

Semiconductor wafers, are processed using minimally three processing operations: a first double-sided polishing operation, a second chemical-mechanical polishing operation and an epitaxial coating operation. A control system for conducting the method defines at least one operating parameter for the processing operations specifically based on at least one wafer parameter measured on the semiconductor wafer after processing in at least one processing operation, based on an actual state of a processing apparatus with which the respective processing operation is conducted, and based on optimizing wafer parameters for flatness after the wafer has undergone all three processing operations instead of optimizing each individual processing step for optimal flatness.

A processing system for processing spectacle lenses and a method for processing spectacle lenses are proposed. The processing system has several processing stations, in particular a milling station, a turning station, a polishing station, a cleaning station and/or a signing station. Furthermore, the processing system has a transport system for transporting the spectacle lenses and/or transport containers for the spectacle lenses. Preferably, the processing system also has a common base frame and/or a common casing for the processing stations. In the processing system and/or with the method, several spectacle lenses can be processed simultaneously in different processing stations.

To change the direction of water flowing toward a painted surface so as to flow toward the center side of a hood, a water deflecting member is provided that extends toward the center side of the hood while extending toward the painted surface as seen in a state where automatic wet sanding is performed. Thus, water bouncing off the painted surface is less likely to scatter over a wide area of the painted surface, and sanding dust is also less likely to scatter over a wide area of the painted surface. As a result, it is possible to eliminate the need for the troublesome task of wiping off sanding dust remaining on the painted surface, and to achieve a quality finish on the painted surface.

In an automatic wet sanding apparatus including a paper peeling unit that has a clamping shaft and a clamping hook, an inclination angle of a leading end surface of the clamping hook is equal to an inclination angle of an outer circumferential surface of a cushion pad at the start of a paper peeling step. Thus, the leading end surface of the clamping hook comes into contact with an outer circumferential end of a disc at the same time as coming into contact with the outer circumferential surface of the cushion pad, so that the cushion pad is less likely to get caught due to deformation of the outer circumferential surface and its peripheral part of the cushion pad. It is therefore possible to appropriately remove the sandpaper from the cushion pad and stably perform the task of removing the sandpaper.

In an automatic wet sanding apparatus including a disc and a cushion pad, a disc center hole is formed at a central portion of the disc and a pad center hole is formed at a central portion of the cushion pad. Water having been supplied to an introduction space inside a skirt is stirred as an eccentric head rotates eccentrically and thereby pushed out toward a painted surface via the disc center hole and the pad center hole with enhanced pressure. Thus, sanding dust resulting from automatic wet sanding can be washed away toward an outer circumferential side by the water that is pushed out toward the outer circumferential side, so that the likelihood of clogging due to sanding dust can be reduced and high sanding efficiency can be maintained.