The present document describes a blade sharpening system comprising a blade sharpening device, a blade holding apparatus and a controller operatively coupled to the blade sharpening device and said blade holding apparatus to control sharpening of said blade, and methods of using the same.

Various examples of a substrate cleaning apparatus and a substrate processing apparatus are described in the present disclosure. One example of the present invention is a substrate cleaning apparatus including a roll cleaning member cleaning a substrate, an inclination sensor detecting an inclination of the roll cleaning member, and an output device outputting a detection result of the inclination sensor.

An automatic machine and an automatic method for grinding the edges of glass sheets are disclosed. The machine is provided with a machine body with motorized support and conveyance rollers or belts, an input conveyor with motorized support and conveyance rollers or belts, an output conveyor with motorized support and conveyance rollers and belts. There are at least two elements for conveying the glass sheets, a lower one and an upper one, which actuate respectively the synchronous motions about a lower axis and an upper axis, which engage and convey the glass sheets, which are interfaced alternately, for example the odd sheets with the lower conveyance elements and the even sheets with the upper conveyance.

According to one embodiment, there is provided a top ring for holding a substrate. The top ring comprises a substrate supporting surface, a retainer member disposed to surround an outer periphery of the substrate supporting surface, and a retainer guiding device configured to guide the retainer member so as to allow the retainer member to be displaced in a direction perpendicular to the substrate supporting surface, and support the retainer member so as to inhibit the retainer member from being displaced in a direction parallel to and away from the substrate supporting surface. The retainer guiding device is disposed in an inner side of the retainer member surrounding the substrate supporting surface.

A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.

A wheel corner polishing device includes a station switching system, a valve hole polishing system, a bolt hole polishing system and a rim and cap section synchronous polishing system. The wheel corner polishing device can automatically polish four positions including bolt hole corners, a valve hole corner, outer rim corners and cap section corners of a wheel via upper and lower stations and coordination of the systems.

The present invention relates to an integrated processing machine for positioning, trimming and punching of the ceiling splicing structure, comprising a rack and a mounting base for processing at the lower part of the rack, which is provided with a lifting and clamping device passing through the rack cooperating with the splice plate, the upper part of the rack is provided with a processing port, which cooperates with a trimming and positioning device, the trimming and positioning device comprises a lifting cylinder for trimming and positioning disposed on the mounting base for processing, the lifting cylinder for trimming and positioning is connected with a mounting base for trimming and positioning, the mounting base for trimming and positioning is provided with a first trimming knife and a second trimming knife which cooperates with the two splice plates respectively, and the mounting base for processing is provided with a processing mechanism matching with the processing mating port and cooperating with two splice plates; In the present invention, the trimming and positioning device and the processing device are designed to cooperate with each other, the trimming and positioning device is able to complete the trimming of the side slits of the splice plates while positioning the two splice plates without interfering with the operation of the hole and groove processing device, which greatly improves the efficiency of integrated processing.

A sanding machine, in particular for processing wood surfaces, includes a support and transport plane for the forwarding of the workpieces to be processed; and a belt sanding unit with a transverse abrasive belt inside which a pressure pad is arranged obliquely. The pressure pad is divided into a plurality of pressure elements which can be actuated individually and are controlled by respective sensors that constitute a control beam. Methods are described for compensating the different distances between sensor and respective pressure elements that avoid adaptations of the position of the workpiece to be processed, in particular if the machine contains further non inclined processing units. The sanding machine is particularly suitable even for the processing of large workpieces.

The invention relates to an apparatus for machining the running edges of a sporting device, more particularly a ski or a snowboard, comprising a transport apparatus, which can be temporarily connected to the sporting device, for the automated movement of the sporting device in a movement sequence having, at least in parts, a movement direction substantially parallel to the longitudinal direction of the sporting device, wherein the following are located one behind the other in said movement sequence of the sporting device: a lower-edge machining unit for machining a lower surface of at least one running edge, said lower surface laterally adjoining the running-surface covering of the sporting device; a lateral-edge machining unit for machining a lateral surface of the at least one running edge, said lateral surface adjoining the bottom of the lateral surface of the sporting device; and a deburring unit for removing a burr formed by the lateral-edge machining unit on the at least one running edge.

A grinding apparatus that performs thickness measurement across an entire wafer surface without degradation of throughput of wafer grinding and grinds the wafer precisely to a target thickness. A grinding apparatus includes a rough grinding stage for roughly grinding a wafer and a fine grinding stage for finely grinding the wafer. A first thickness measuring means for measuring the thickness of the wafer while the wafer is being transferred is provided to a column so disposed as to span an index table. A control unit of the grinding apparatus corrects a target thickness after fine grinding and computes a target thickness after correction on the basis of an average thickness across the entire surface of the wafer before fine grinding obtained from measured values of the first thickness measuring means.