A method of processing a wafer includes a cutting step of cutting the face side of the wafer with a cutting blade to form grooves therein along projected dicing lines, a first inspecting step of capturing an image of the grooves formed in the cutting step and inspecting a state of a chip in the captured image of the grooves, a protecting member sticking step of sticking a protective member to the face side of the wafer, a grinding step of holding the protective member side of the wafer on a chuck table and grinding a reverse side of the wafer to thin the wafer to a finished thickness, thereby dividing the wafer into device chips, a second inspecting step of capturing an image of the grooves exposed on the reverse side of the wafer and inspecting a state of a chip in the captured image of the grooves.

A wheel outer rim fillet dressing device, wherein after a wheel is roughly positioned, an electric cylinder drives a moving plate to descend to an appropriate position, an adjusting cylinder drives a second sliding table to move away from a first sliding table, the first sliding table moves synchronously with the second sliding table under the action of a second gear rack, thus the distance between a precision positioning post on the first sliding table and a precision positioning post on the second sliding table is adjusted, and the precision positioning posts contact a vertical surface of a cap seam allowance of the wheel and hold the wheel tightly. The adjusting cylinder is restarted, and the outer rim fillets can be dressed when the distance between first and second cutters for dressing wheel outer rim fillets is adjusted to an appropriate position and under the cooperation of the rotating wheel.

Wheel blank positioning lip correction device comprises an end mill and a grinding wheel, etc. The first linear motor is mounted at the upper part of the frame, which controls lifting of the feeding slide plate. Output end of the second linear motor is connected with the inner slide block. The second servo motor is mounted on the inner slide block, the end mill is mounted at output end of the second servo motor. The lifting linear motor is fixed on the motor support plate, which controls lifting of the lifting table. Output end of the third linear motor is connected with the outer slide block. The third servo motor is mounted on the outer slide block, which controls rotation of the grinding wheel. The end mill and the grinding wheel are used for correcting the axial positioning surface and the radial positioning surface of the positioning lip respectively.

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

A finishing device for finish machining of a workpiece, in particular of a crankshaft or a camshaft, comprising a workpiece holder and a rotary drive for rotating the workpiece about the workpiece axis thereof, comprising at least one first finishing tool for machining a main bearing concentric to the workpiece axis and at least one second finishing tool for machining an additional bearing, wherein the finishing tools can be moved along a transport axis which extends via a working area defined by the workpiece holder so that the finishing tools can be moved into an additional area arranged outside the working area.

A grinding apparatus includes a table having a holding surface, a grinding unit grinding a wafer held on the holding surface, a notification portion notifying an operator of information, an imaging unit illuminating a ground surface of the wafer which is held and ground with an illumination and imaging the ground surface, a detecting portion detecting a cross line in an imaged picture, a memory storing an X-axis and Y-axis coordinate position of an intersection point of the cross line detected, a spotlight illuminating the holding surface at the X-axis and Y-axis coordinate position stored, and a controller causing the notification portion to notify the operator that the cross line has been detected and stopping grinding operations of the grinding apparatus.

A modular apparatus (10) for machining flat sheets, in particular glass, plate glass, or mirror sheets or sheets made from stone materials or the like, comprising machining moduli consisting of a first store (16) suitable for receiving sheets to be machined (25) and a second store (18) suitable for receiving machined sheets (27), a first grinding machine (12), and a second grinding machine (14) suitable for performing grinding machinings along the peripheral edges of said sheets (25), one or more further moduli for machining said flat sheets, if any, of the corner cutting, drill, or washing machine types, possibly associated with said first and second grinding machines (12, 14), and interface means for transferring said flat sheets between said machining moduli.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A support base supports a plate-shaped workpiece. The support base includes a flat plate-shaped box member having a support face for supporting a workpiece and a placement face that is a face on the opposite side to the support face and is placed on a holding face of a chuck table, a temperature measurement unit accommodated in the box member, and a battery accommodated in the box member and serving as a power supply for the temperature measurement unit. The temperature measurement unit includes a temperature measuring instrument that measures a temperature at the support face, and a recording unit that records the temperature measured by the temperature measuring instrument.

Disclosed is a device for removing tool joint edge burrs from a cap opening of a wheel. Four positioning rods circumferentially form a cone, and angle adjusting cylinders drive sliding blocks to move up and down. An electric cylinder drives an adjusting cone to move up and down to adjust the distance between a left cutting edge and a right cutting edge, and by adjusting the distance between the cutting edges, a cutter system is prevented from interfering with a narrow cap opening during descending, and an L-shaped revere chamfer cutter can be formed. According to the invention, not only is the space saved, but also the working efficiency is improved. The device can automatically remove burrs from a first and second tool joint inside a cap opening, can be used for automatic continuous production, and is advanced, stable, efficient and high in accuracy.